Optical Interposer Layout for Evanescent Laser Coupling

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Solution Overview

Problem

Existing technologies face challenges in efficiently integrating optical and electrical components for signal transmission and processing, particularly in forming compact devices that can convert between optical and electrical signals while minimizing contamination and ensuring reliable electrical connections.

Innovation Solution

The development of a compact universal photonic engine (COUPE) that embeds laser dies within an optical interposer, using evanescent coupling to connect optical devices, and employs advanced manufacturing processes like epitaxial growth and dielectric-to-dielectric bonding to form a robust and contamination-resistant structure.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If optical and electrical components are integrated in a compact device, then signal transmission efficiency is improved, but contamination risk increases

Engineering Contradiction:

Improvesignal transmission efficiencyVSAvoidcontamination risk

Core Design Contradiction:

ProductivityVSObject-affected harmful factors

Solution Approach 1:

The device is divided into separate optical and electrical component regions, with optical components (laser die, optical waveguides) integrated into an optical interposer and electrical components mounted on a substrate. This segmentation allows independent optimization and contamination control for each component type while maintaining compact integration for efficient signal transmission.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

An optical interposer serves as an intermediary structure between optical and electrical components. The interposer includes optical waveguides that couple to laser dies and facilitate optical signal transmission, while electrical interconnects provide electrical connections. This intermediary structure minimizes direct contact between optical and electrical components, reducing contamination risk.

Inventive Principle:

Principle #24Intermediary (Mediator)

2Volume of moving object

If optical components are embedded in a compact structure, then device size is reduced, but manufacturing complexity increases

Engineering Contradiction:

Improvedevice sizeVSAvoidmanufacturing complexity

Core Design Contradiction:

Volume of moving objectVSDevice complexity

Solution Approach 1:

Optical components (laser dies, optical waveguides) are pre-integrated into the optical interposer structure before final assembly with electrical components. The optical interposer is fabricated with embedded optical waveguides and coupling structures in advance, which simplifies the final assembly process and reduces overall manufacturing complexity despite the compact embedded design.

Inventive Principle:

Principle #10Preliminary action

Solution Approach 2:

Optical components are nested within the optical interposer structure, with optical waveguides embedded in the interposer substrate and laser dies coupled to waveguide ends. This nested arrangement achieves compact device size by placing smaller components within the structure of larger components, while the modular nested design actually reduces manufacturing complexity compared to fully integrated monolithic structures.

Inventive Principle:

Principle #7Nested doll (Nesting)

3Reliability

If electrical interconnects are formed through dielectric layers, then electrical connections are reliable, but manufacturing precision requirements increase

Engineering Contradiction:

Improveelectrical connection reliabilityVSAvoidinterconnect formation precision

Core Design Contradiction:

ReliabilityVSManufacturing precision

Solution Approach 1:

Electrical interconnects are formed as separate conductive traces within dielectric layers, segmented from other structural elements. This segmentation allows independent formation and optimization of electrical interconnect paths, ensuring reliable electrical connections while enabling separate process control to manage manufacturing precision requirements.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The dielectric layers are engineered with local variations in properties to facilitate reliable electrical interconnect formation. Specific regions have optimized dielectric constants, breakdown voltages, and mechanical properties tailored to the local electrical connection requirements, allowing high reliability without uniformly increasing manufacturing precision across the entire device.

Inventive Principle:

Principle #3Local quality

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach enables efficient signal conversion and transmission by minimizing contamination risks and ensuring reliable electrical connections, thereby enhancing the performance and reliability of optical-electrical hybrid devices.

Implementation Method 1

The laser die is evanescently coupled to a set of optical waveguides

Methodology Applied

Scientific EffectEvanescent coupling:

Data Source

PatentUS20250355174A1Optical device and method of manufacture

Publication Date: 2025.11.20 TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD

AI summary

Optical devices and methods of manufacture are presented in which a laser die or other heterogeneous device is embedded within an optical device and evanescently coupled to other devices. The evanescent coupling can be performed either from the laser die to a waveguide, to an external cavity, to an external coupler, or to an interposer substrate.