Optical Interposer Mirror Structure for Fiber-to-PIC Coupling
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Solution Overview
Problem
Existing technologies face challenges in efficiently integrating optical and electrical signaling components for seamless signal transmission and processing, particularly in devices that require both long-range optical and short-range electrical connections.
Innovation Solution
A photonic integrated circuit (PIC) with a silicon-on-insulator substrate is used to create an optical interposer, incorporating optical and electrical components, and a mirror structure for routing optical signals between an optical fiber and an edge coupler, utilizing dielectric and metal-to-metal bonding processes for integration.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If optical and electrical components are integrated in a single device, then signal transmission capabilities are enhanced, but device complexity increases
Solution Approach 1:
The device is divided into separate optical and electrical components that are integrated through a substrate. The optical component includes optical waveguides and couplers, while the electrical component includes electrical interconnects and bonding pads. This segmentation allows each component to be optimized independently while maintaining overall system functionality, thus enhancing signal transmission capabilities without excessively increasing device complexity.
Solution Approach 2:
The substrate serves multiple functions simultaneously: it provides mechanical support for both optical and electrical components, enables thermal management through heat dissipation pathways, and facilitates electrical connections through conductive interconnects. This multi-functionality allows the device to handle both optical and electrical signaling within a single integrated structure, enhancing versatility while controlling complexity.
2Reliability
If optical fibers are coupled to edge couplers using mirror structures, then coupling efficiency is improved, but manufacturing precision requirements increase
Solution Approach 1:
The mirror structure is pre-formed on the substrate at a defined location before the optical fiber is positioned. The mirror is integrated into the substrate during the fabrication process, establishing a predetermined reflection pathway. This preliminary action allows the optical fiber to be coupled to the edge coupler with precise angular alignment, improving coupling efficiency while the mirror's position is controlled during manufacturing to manage precision requirements.
Solution Approach 2:
The mirror structure acts as an intermediary element between the optical fiber and the edge coupler. It reflects optical signals at a specific angle to facilitate coupling into the edge coupler, which is positioned at the side of the optical component. This intermediary mirror enables efficient optical coupling by mediating the light path, while its integration into the substrate provides a stable reference for manufacturing alignment.
3Reliability
If dielectric and metal-to-metal bonding processes are used for integration, then integration reliability is improved, but manufacturing complexity increases
Solution Approach 1:
The dielectric bonding and metal-to-metal bonding processes are combined in a single integration sequence. The substrate includes both dielectric layers for electrical isolation and metal interconnect layers for electrical connections. By merging these bonding processes, the device achieves reliable integration of optical and electrical components through multiple bonding interfaces simultaneously, while the combined process reduces the number of separate manufacturing steps compared to performing dielectric and metal bonding separately.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables efficient conversion and processing of optical and electrical signals, facilitating seamless integration and enhancing signal transmission capabilities in devices with both long-range optical and short-range electrical components.
Implementation Method 1
a mirror structure for routing optical signals between an optical fiber and an edge coupler
Implementation Method 2
utilizing dielectric and metal-to-metal bonding processes for integration
Implementation Method 3
utilizing dielectric and metal-to-metal bonding processes for integration
Data Source
AI summary
Optical devices and methods of manufacture are presented in which a mirror structure is utilized to transmit and receive optical signals to and from an optical device. In embodiments the mirror structure receives optical signals from outside of an optical device and directs the optical signals through at least one mirror to an optical component of the optical device.