CMOS-Compatible Optical Interposer With Layered Photonic Integration
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Solution Overview
Problem
Existing optical interposers face challenges in integrating with CMOS manufacturing processes due to the need for lens and mirrors, limiting flexibility and compatibility, and lack opto-electronic structures within them, which complicates bonding and connection mechanisms.
Innovation Solution
An optical interposer with integrated optical structures like photonic modulators, photo detectors, and waveguides, utilizing electrical interfaces and multiple dielectric layers, compatible with CMOS processes, allowing flexible integration with chips using existing interconnect technologies.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If traditional optical interposers use lenses and mirrors for optical signal transmission, then optical signal transmission is achieved, but device complexity and manufacturing difficulty increase
Solution Approach 1:
The patent extracts and removes the complex lens and mirror components from the optical interposer structure. Instead of using traditional optical elements, the invention employs planar photonic structures directly integrated into the interposer substrate, thereby eliminating the need for separate lenses and mirrors while maintaining optical signal transmission functionality
Solution Approach 2:
The patent replaces the mechanical optical system (lenses and mirrors requiring precise physical alignment) with an integrated photonic circuit system using planar waveguides and photonic structures. This substitution eliminates mechanical alignment requirements and simplifies the overall device structure while achieving the same optical signal transmission function
2Reliability
If traditional optical interposers use lenses and mirrors, then optical coupling is achieved, but ease of manufacture decreases due to bonding and connection complexity
Solution Approach 1:
The patent merges the optical coupling function directly into the interposer substrate by integrating planar photonic structures. This consolidation eliminates the need for separate coupling components and simplifies the bonding process, as the optical interfaces are formed as part of the standard semiconductor fabrication process rather than requiring additional assembly steps
Solution Approach 2:
The patent creates a universal optical interposer platform using standard photonic structures that can be integrated with various chip types and configurations. The planar photonic circuits provide multi-functional capabilities including waveguiding, coupling, and signal routing within a single integrated structure, reducing the need for specialized components and simplifying manufacturing
3Ease of manufacture
If optical interposers lack integrated opto-electronic structures, then manufacturing is simpler, but functionality and performance are limited
Solution Approach 1:
The patent segments the optical interposer into distinct functional photonic structures (waveguides, couplers, modulators) that are separately designed and then integrated using standard fabrication processes. This segmentation allows each functional element to be optimized independently while maintaining overall manufacturing simplicity through modular integration approaches
Solution Approach 2:
The patent transitions from three-dimensional optical components (lenses and mirrors requiring vertical alignment) to two-dimensional planar photonic structures. This dimensional reduction enables integration within the planar interposer substrate while providing enhanced functionality through circuit-like photonic pathways, effectively adding functional complexity without increasing manufacturing dimensionality
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enhances optical signal integrity and flexibility in integration by avoiding lenses and mirrors, improving functionality, performance, and reliability through electrical connectivity and precise vertical alignment of photonic structures.
Implementation Method 1
The optical interposer includes multiple dielectric layers with integrated optical structures such as photonic modulators, photo detectors, and waveguides
Data Source
AI summary
A semiconductor structure includes an optical interposer having at least one first photonic device in a first dielectric layer and at least one second photonic device in a second dielectric layer, wherein the second dielectric layer is disposed above the first dielectric layer. The semiconductor structure further includes a first die disposed on the optical interposer and electrically connected to the optical interposer; a first substrate under the optical interposer; and conductive connectors under the first substrate.