Optical Interposer Layout for High-Bandwidth 3D Photonic Packaging
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Solution Overview
Problem
Current computing systems face limitations in achieving high-bandwidth optical communication within a compact and power-efficient design, as they often rely on traditional electrical signaling and processing methods that are not optimized for high-speed data transmission.
Innovation Solution
The development of three-dimensional (3D) computing packages incorporating optical interposers with waveguides and photonic devices, which enable high-bandwidth optical communication by integrating optical fibers and photonic components, such as photodetectors and modulators, to facilitate optical communication both within the system and with external components.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If traditional electrical signaling methods are used for signal transmission, then the system structure is simple and easy to manufacture, but the bandwidth and transmission speed are limited
Solution Approach 1:
The patent replaces traditional electrical signaling (electromagnetic field in conductors) with optical signaling (light propagation in waveguides). This substitution enables higher bandwidth and transmission speeds while reducing power consumption, directly resolving the contradiction between productivity (bandwidth) and device complexity by using a fundamentally different physical domain (optics vs. electronics).
Solution Approach 2:
The patent changes the fundamental transmission parameter from electrical signals to optical signals, utilizing the properties of light (higher frequency, lower attenuation) to achieve greater bandwidth. This parameter change allows the system to overcome the bandwidth limitations of electrical signaling while the modular photonic integration approach keeps complexity manageable.
2Speed
If optical fibers and photonic components are integrated for high-bandwidth communication, then transmission speed and bandwidth increase, but the device size and manufacturing complexity increase
Solution Approach 1:
The patent merges multiple photonic components (waveguides, modulators, detectors, couplers) and electrical interconnects onto a single integrated photonic chip. This consolidation achieves high transmission speeds through optical signaling while simplifying manufacturing by reducing the number of discrete components and assembly steps, directly addressing the contradiction between speed and ease of manufacture.
Solution Approach 2:
The photonic chip is designed as a universal platform that can be configured for different communication applications and integrated with various electronic devices. The standardized waveguide structures and component interfaces enable scalable manufacturing across different product configurations, reducing overall manufacturing complexity while maintaining high transmission speeds.
3Loss of energy
If optical signaling is used for long-range transmission, then signal loss is reduced, but the system requires additional optical components increasing complexity
Solution Approach 1:
The patent uses integrated waveguides as intermediary structures that efficiently couple light between optical fibers and on-chip photonic components. These waveguides minimize signal loss during transitions while maintaining a compact form factor. The monolithic integration of waveguides with other photonic components on the same chip reduces the number of discrete optical elements needed, thereby reducing complexity while maintaining low signal loss.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach allows for reduced size, power consumption, and latency in computing systems while enabling high-speed optical communication, enhancing flexibility and design efficiency by combining optical and electrical interposers for both internal and external connectivity.
Implementation Method 1
photonic devices, such as photodetectors and modulators, to facilitate optical communication
Implementation Method 2
at least one photonic device on the first substrate, wherein the at least one photonic device is optically coupled to the first waveguide
Data Source
AI summary
A structure includes an optical interposer attached to a package substrate, wherein the optical interposer includes a silicon waveguide, a first photonic component optically coupled to the silicon waveguide, a second photonic component optically coupled to the silicon waveguide, and an interconnect structure extending over the silicon waveguide, over the first photonic component, and over the second photonic component, wherein the interconnect structure is electrically connected to the first photonic component and to the second photonic component, a first semiconductor device attached to the interconnect structure, wherein the first semiconductor device is electrically connected to the first photonic component through the interconnect structure, and a second semiconductor device attached to the interconnect structure, wherein the second semiconductor device is electrically connected to the second photonic component through the interconnect structure.