Optical Interposer Shielding for Reduced Surface Interference
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Solution Overview
Problem
Conventional optical components in datacenter and networking systems face challenges in supporting increasing bandwidth demands due to interference issues and high production costs, particularly with dielectric couplers, which are complex and costly to manufacture and align.
Innovation Solution
The use of optical interposer substrates with a passivation layer and embedded metallic shielding elements to reduce interference, combined with metallic optical couplers that are cost-effectively manufactured using techniques like metal stamping, and integrated lenses or gratings to enhance signal transmission.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If dielectric couplers are used in conventional optical components, then optical signal transmission is enabled, but manufacturing complexity and production costs increase significantly
Solution Approach 1:
The patent replaces dielectric couplers with metallic couplers that utilize electromagnetic coupling between metal traces on the interposer substrate and metal traces on connected substrates. This substitution eliminates the need for complex dielectric layer structures and reduces alignment requirements, as the electromagnetic coupling provides inherent tolerance to misalignment while enabling cost-effective manufacturing through standard PCB trace routing techniques.
Solution Approach 2:
The patent changes the coupling mechanism from dielectric-based optical coupling to metal-based electromagnetic coupling. This parameter change in the coupling medium allows for relaxed alignment tolerances and simplified manufacturing processes, as metal traces can be precisely routed on PCB substrates using conventional fabrication methods without requiring the complex multi-layer dielectric stacking and alignment procedures needed for dielectric couplers.
2Reliability
If conventional optical components are used, then signal transmission is achieved, but interference issues prevent support for increasing bandwidth demands
Solution Approach 1:
The patent introduces an optical interposer substrate with ground traces as an intermediary element between the optical transmitter and the connected substrate. The ground traces act as a shielding intermediary that blocks electromagnetic interference from affecting the high-speed signal transmission, while still allowing the metallic couplers to function effectively. This intermediary ground structure creates interference-free zones that protect the signal integrity for higher bandwidth applications.
Solution Approach 2:
The patent implements preliminary anti-action by placing ground traces and shielding structures in advance around the signal transmission paths and metallic couplers. These ground structures are designed to preemptively block potential electromagnetic interference before it can affect the signal, creating a protected transmission environment that enables reliable high-bandwidth communication by counteracting interference sources before they can degrade signal quality.
3Volume of moving object
If component thickness is reduced for compactness, then transceiver assemblies become more compact, but interference between surfaces increases
Solution Approach 1:
The patent uses ground traces embedded in the interposer substrate as intermediary shielding elements that actively block interference between the first and second surfaces. Even when the overall component thickness is reduced to achieve compactness, these ground trace intermediaries maintain interference isolation by creating electromagnetic barriers within the compressed structure, allowing thin-profile designs without sacrificing interference protection.
Solution Approach 2:
The patent applies local quality by implementing ground traces and shielding structures specifically in the regions where interference is most likely to occur between surfaces, rather than uniformly throughout the entire component. This localized shielding approach maintains compact thickness while providing targeted interference protection where needed, optimizing the balance between compactness and interference reduction.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution reduces interference, minimizes component thickness, and enhances signal transmission efficiency, leading to improved communication capabilities and more compact transceiver assemblies while lowering production costs.
Implementation Method 1
The passivation layer may include a metallic shielding element configured to prevent interference between the first surface and the second surface
Implementation Method 2
The optical interposer substrate may be configured to receive an optical signal from the optical transmitter via the optical path
Implementation Method 3
the optical interposer may be configured to collimate or shape the optical signal
Implementation Method 4
the metallic shielding element may define an integrated lens positioned within the opening and along the optical path
Implementation Method 5
the metallic shielding element may define a one-dimensional (1D) metallic grating positioned within the opening and along the optical path
Data Source
AI summary
Optical components and associated methods of manufacturing are provided. An example optical component includes a body defined by an optical interposer substrate and a passivation layer applied to the optical interposer substrate. The optical interposer substrate defines a first surface of the body, and the passivation layer defines a second surface of the body opposite the first surface. The passivation layer includes a metallic shielding element configured to prevent interference between the first surface and the second surface. The optical component further includes an opening extending from the second surface to the optical interposer substrate, the opening defining an optical path through the passivation layer. The optical interposer substrate receives an optical signal from an optical transmitter supported by the second surface via the optical path.