Optical Interposer Packaging for Signal Redirection and Coupling
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Solution Overview
Problem
Existing technologies face challenges in efficiently integrating optical and electrical signaling components within semiconductor packages, particularly in achieving high-bandwidth signal transmission and processing, due to limitations in converting and redirecting optical signals between different pathways.
Innovation Solution
The development of a photonic integrated circuit (PIC) device, or optical interposer, which includes edge couplers and optical components like waveguides and modulators, integrated with an electronic integrated circuit (EIC) device to form a compact universal photonic engine (COUPE), facilitating high-bandwidth signal transmission and processing through dielectric and metal-to-metal bonding processes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If optical and electrical signaling components are integrated within semiconductor packages, then signal transmission and processing capabilities are enhanced, but device complexity increases
Solution Approach 1:
The patent integrates optical components (edge couplers, waveguides) and electrical components (electronic integrated circuit device) into a single semiconductor package, merging previously separate optical and electrical signaling systems into one unified device structure
Solution Approach 2:
The semiconductor package is designed to perform multiple functions simultaneously: optical signal transmission, electrical signal processing, and conversion between optical and electrical signals, making the device universal and multi-functional
2Productivity
If optical signals are converted and redirected between different pathways, then signal transmission efficiency is improved, but manufacturing precision requirements increase
Solution Approach 1:
The patent introduces an optical interposer with edge couplers as an intermediary component that facilitates the conversion and redirection of optical signals between different pathways, enabling efficient signal transmission while managing the complexity of precise optical coupling
Solution Approach 2:
The optical interposer adds a dimensional layer between optical components, allowing optical signals to be redirected through a separate spatial dimension (the interposer layer) rather than requiring direct precise coupling between all optical elements
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The integration of the optical interposer with the electronic device enhances signal transmission and processing capabilities, enabling efficient conversion and redirection of optical signals within semiconductor packages.
Implementation Method 1
an optical redirection structure configured to redirect an optical signal between a first pathway and a second pathway
Data Source
AI summary
In an embodiment, a method includes: forming an optical package, forming the optical package comprising: forming optical devices over a substrate; forming a first interconnect structure over the optical devices; and attaching a first semiconductor device to the optical devices; attaching a second semiconductor device to an interposer substrate; attaching the optical package to the interposer substrate; and attaching an optical port adjacent to the optical package, the optical port comprising: an optical fiber; and an optical redirection structure configured to redirect an optical signal between a first pathway and a second pathway, the first pathway being parallel with a major surface of the interposer substrate, the second pathway being non-parallel with the major surface of the interposer substrate.