Optical Interposer Structure for High-Bandwidth Low-Power Links
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Solution Overview
Problem
Current computing systems face limitations in achieving high-bandwidth optical communication within a compact and power-efficient design, as they often rely on traditional electrical signaling and processing methods that hinder the integration of optical interconnects effectively.
Innovation Solution
The development of a 3D computing system that incorporates optical interposers with waveguides and photonic devices, enabling high-bandwidth optical communication by integrating optical fibers and grating couplers, along with electrical interposers for electrical routing, to facilitate both internal and external optical connections.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If traditional electrical signaling and processing methods are used, then electrical signal transmission and processing can be achieved, but high-bandwidth optical communication and power efficiency cannot be realized
Solution Approach 1:
The patent replaces traditional electrical signaling mechanisms with optical signaling mechanisms. Specifically, electrical signals are converted to optical signals using photonic devices (such as modulators and lasers) integrated on the semiconductor substrate, enabling optical communication instead of electrical communication for data transmission between computing units.
Solution Approach 2:
The patent changes the fundamental parameter of signal transmission from electrical domain to optical domain. By using optical carriers instead of electrical signals, the system achieves higher bandwidth capacity and lower power consumption, as optical signals can carry more information and experience less attenuation and interference.
2Productivity
If optical interconnects are integrated into computing systems, then high-bandwidth optical communication can be achieved, but device complexity and integration difficulty increase
Solution Approach 1:
The patent merges optical interconnect functionality directly into the computing unit substrate by integrating photonic devices (modulators, detectors, waveguides) with electronic circuitry on the same semiconductor platform. This consolidation eliminates the need for separate optical modules and reduces integration complexity.
Solution Approach 2:
The computing unit substrate is designed to perform multiple functions: it serves as both the electronic processing platform and the optical communication platform. The same substrate that hosts electronic circuits also integrates photonic devices, making the substrate universal for both electrical and optical operations.
3Adaptability or versatility
If optical fibers and grating couplers are integrated for optical connections, then external and internal optical communication can be facilitated, but manufacturing precision requirements increase
Solution Approach 1:
The grating couplers are designed with self-aligning features that automatically position optical fibers during the attachment process. The periodic structure of the grating coupler creates a unique optical field distribution that guides the fiber into the correct position, eliminating the need for complex external alignment equipment or manual adjustment.
Solution Approach 2:
The grating coupler acts as an intermediary component between the optical fiber and the waveguide. It provides a transition region that couples light from the fiber mode to the waveguide mode, accommodating differences in mode profiles and reducing sensitivity to misalignment through its periodic diffraction structure.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables reduced size, power consumption, and latency in computing systems while providing high-speed optical communication, enhancing flexibility and reducing costs by integrating optical and electrical interconnects seamlessly.
Implementation Method 1
a grating coupler on the first substrate, wherein the optical fiber is optically coupled to the first waveguide by the grating coupler
Data Source
AI summary
A structure includes an optical interposer attached to a package substrate, wherein the optical interposer includes a silicon waveguide, a first photonic component optically coupled to the silicon waveguide, a second photonic component optically coupled to the silicon waveguide, and an interconnect structure extending over the silicon waveguide, over the first photonic component, and over the second photonic component, wherein the interconnect structure is electrically connected to the first photonic component and to the second photonic component, a first semiconductor device attached to the interconnect structure, wherein the first semiconductor device is electrically connected to the first photonic component through the interconnect structure, and a second semiconductor device attached to the interconnect structure, wherein the second semiconductor device is electrically connected to the second photonic component through the interconnect structure.