Optical Transceiver Isolator Mounting Without Adhesive Drift

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Solution Overview

Problem

The existing method of bonding optical components with adhesive in optical transceiver modules leads to instability due to temperature-induced displacement, increased risk of isolator detachment, and signal attenuation, compromising the reliability and maintenance costs of the communication system.

Innovation Solution

A detachable optical component structure featuring a grooved magnetic ring with mounting grooves for isolator and fiber array fixture, combined with a precise locating and connection mechanism using snap-fits and pin holders, eliminates adhesive bonding and allows for independent component replacement and adjustment.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of manufacture

If adhesive bonding is used to bond optical components, then assembly is simplified, but position stability deteriorates under temperature changes

Engineering Contradiction:

Improveassembly simplicityVSAvoidposition stability

Core Design Contradiction:

Ease of manufactureVSStability of the object's composition

Solution Approach 1:

The patent replaces the chemical bonding system (adhesive) with a magnetic field-based holding system. The magnetic ring generates a magnetic field that holds the isolator in position without physical contact, eliminating the position drift issue inherent in adhesive bonding while maintaining ease of assembly through simple magnetic attraction.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

Solution Approach 2:

The patent introduces a magnetic ring as an intermediary component between the isolator and the housing. This magnetic ring acts as a mediator that provides stable positional holding through magnetic field interaction, solving the position stability problem while keeping the assembly process simple.

Inventive Principle:

Principle #24Intermediary (Mediator)

2Reliability

If multiple bonding operations are performed, then component fixation is achieved, but risk of isolator detachment increases

Engineering Contradiction:

Improvecomponent fixationVSAvoidisolator detachment risk

Core Design Contradiction:

ReliabilityVSObject-affected harmful factors

Solution Approach 1:

The patent replaces multiple mechanical bonding operations with a single magnetic field-based holding system. The magnetic ring provides continuous, uniform holding force that eliminates the risk of detachment associated with multiple bonding operations, while the laser-welded connection of the magnetic ring to the housing ensures permanent fixation.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

Solution Approach 2:

The patent changes the bonding mechanism from chemical (adhesive) to magnetic field interaction. This parameter change allows for reliable component fixation through magnetic attraction while eliminating the cumulative risk of detachment that arises from multiple bonding operations.

Inventive Principle:

Principle #35Parameter changes

3Ease of manufacture

If adhesive bonding is used, then assembly process is simplified, but signal attenuation increases

Engineering Contradiction:

Improveassembly process simplicityVSAvoidsignal attenuation

Core Design Contradiction:

Ease of manufactureVSLoss of energy

Solution Approach 1:

The patent replaces adhesive bonding with a magnetic field-based holding system that does not require optical components to be in direct contact with the housing. This eliminates signal attenuation caused by adhesive interference while maintaining assembly simplicity through magnetic attraction and laser welding.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This design enhances stability, reduces maintenance costs, and improves assembly accuracy, extending the service life of the optical transceiver module by minimizing position deviation and isolator detachment risks, while facilitating convenient component replacement.

Implementation Method 1

a grooved magnetic ring detachably connected to the PCB, wherein the grooved magnetic ring comprises a first mounting groove and a second mounting groove communicated with each other; an isolator disposed in the first mounting groove; and a fiber array fixture fastened in the second mounting groove

Methodology Applied

Scientific EffectMagnetic field: Magnetic Field

Data Source

PatentUS20260043970A1Optical component structure and optical transceiver module

Publication Date: 2026.02.12 ACCELIGHT TECH (WUHAN) INC

AI summary

An optical component structure includes a printed circuit board (PCB), the PCB is detachably connected to a grooved magnetic ring, a first mounting groove and a second mounting groove that communicate with each other are provided on the grooved magnetic ring, an isolator is disposed in the first mounting groove, and a fiber array fixture is fastened in the second mounting groove. Impact of a temperature change on a position of an optical component can be effectively reduced, a risk of isolator detachment is reduced, and overall stability and reliability of the optical transceiver module are improved.