Optical Module Assembly With Laminated Substrates for Batch Production
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Solution Overview
Problem
Optical modules are inefficiently manufactured as individual units, leading to high costs and difficulty in maintaining consistency and quality across large numbers of modules.
Innovation Solution
Construct a plurality of optical modules as an assembly comprising a base layer, cover layer, and wall layer, which are laminated substrates with integrated components, and then singulate the assembly into individual modules.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If optical modules are manufactured as individual units, then each module can be assembled with precision, but the manufacturing efficiency is low and costs are high
Solution Approach 1:
The patent merges multiple individual optical modules into a single array structure where multiple modules are integrated on one substrate. This allows simultaneous manufacturing of multiple modules in one production run, dramatically improving productivity while maintaining assembly precision through the unified substrate approach.
Solution Approach 2:
The patent segments the manufacturing process by first creating a complete array of modules as a single unit, then dividing it into individual modules after manufacturing. This segmentation approach allows efficient bulk manufacturing followed by simple separation, resolving the contradiction between manufacturing efficiency and assembly complexity.
2Manufacturing precision
If optical modules are manufactured individually, then quality control can be applied to each module, but consistency across large numbers of modules is difficult to maintain
Solution Approach 1:
By combining multiple modules into a single array manufactured on one substrate, the patent ensures that all modules in the array inherit the same manufacturing conditions, material properties, and process parameters. This guarantees high consistency across all modules while enabling production of large quantities in a single manufacturing run.
3Ease of manufacture
If modules are assembled piece-by-piece, then flexibility in assembly is maintained, but the process is costly and time-consuming
Solution Approach 1:
The patent performs preliminary actions by pre-integrating multiple modules onto a single substrate during the manufacturing process. This preliminary integration eliminates the need for time-consuming piece-by-piece assembly later, as the entire array can be handled and installed as a single unit or pre-assembled into devices before final deployment.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Ensures consistent size and quality of individual modules, facilitating efficient handling and mounting, while providing electromagnetic interference protection and electrical connectivity.
Implementation Method 1
The base layer comprises one circuit board laminated substrate having a plurality of optical components mounted thereon
Implementation Method 2
a plurality of conductive vias are formed in the wall layer to conductively connect the base layer and the cover layer
Data Source
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AI summary
In accordance with various embodiments of the present disclosure, an assembly (100) of a plurality of optical modules (200) is provided. The assembly (100) comprises a base layer (102), a cover layer (180), and a wall layer (120, 140, 160). The base layer (102) comprises one circuit board laminated substrate having a plurality of optical components mounted thereon. The cover layer (180) comprises one circuit board laminated substrate having a plurality of apertures (188, 190) defined therein. Each of the plurality of apertures correspond to a respective one of the plurality of optical modules (200) and align with a respective one of the plurality of optical components. The wall layer (120, 140, 160) is coupled to the base layer (102) and to the cover layer (180) and forms a plurality of external walls. The base layer (102), the cover layer (180), and the wall layer (120, 140, 160) together define a plurality of chambers (132), each corresponding to a respective one of the optical modules (200).