Multi-Wavelength Optical Layout for Tighter Emission Point Spacing
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Solution Overview
Problem
Existing multi-wavelength semiconductor laser devices face challenges in minimizing the gaps between light-emitting points, leading to inefficiencies in reducing the size and complexity of optical devices.
Innovation Solution
The optical device incorporates a substrate with recessed portions for mounting optical semiconductor elements, utilizing a single-sided electrode structure for one element and a two-sided electrode structure for others, along with ridge waveguides to align emission points closely, and employs a flip-chip configuration for efficient electrical connections.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of moving object
If multiple optical semiconductor elements are mounted side by side with light-emitting points near chip ends, then gaps between light emitting points can be minimized, but device size and structural complexity increase
Solution Approach 1:
The patent transitions from planar side-by-side mounting to three-dimensional stacked mounting of optical semiconductor elements. By arranging elements vertically on the same substrate in different layers, the light emitting points can be positioned close together in the horizontal plane while the vertical separation provides structural organization. This dimensional change allows minimizing gaps between emission points without requiring extended horizontal layouts that会增加 structural complexity.
2Volume of moving object
If optical semiconductor elements are mounted close together, then device size is reduced, but heat dissipation becomes more difficult
Solution Approach 1:
The patent implements independent heat dissipation pathways for each optical semiconductor element by providing separate heat dissipation electrodes on the substrate. Each element's heat can be conducted through its own dedicated thermal path to the substrate, preventing heat accumulation even when elements are closely spaced or stacked. This segmentation of thermal management allows compact device sizing while maintaining effective heat dissipation for each individual element.
3Ease of manufacture
If a single-sided electrode structure is used for optical semiconductor elements, then manufacturing is simplified, but electrical connection flexibility is reduced
Solution Approach 1:
The substrate is designed with universal electrical connection capabilities by providing both first electrode pads for single-sided connections and second electrode pads for potential two-sided connections. This universal design allows the same substrate structure to accommodate different connection requirements - elements can be connected via single-sided electrodes to first pads, or if needed, also utilize second pads for additional connection paths. This multi-functionality maintains manufacturing simplicity while providing electrical connection flexibility when required.
Data Source
AI summary
A substrate includes an upper surface and wiring lines disposed on the upper surface. The first optical semiconductor element is disposed on the upper surface of the substrate, and the second optical semiconductor element is adjacent to the first optical semiconductor element. The first optical semiconductor element includes a first electrode and a second electrode each disposed at a lower end portion of the first optical semiconductor element, and each of the first electrode and the second electrode is connected to a corresponding one of the wiring lines.