Optical LED Chip Transfer With Selective Adhesive Dissociation
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Solution Overview
Problem
The challenge of efficiently transferring a large number of LED chips onto a to-be-transferred substrate is significant in LED chip transfer technology.
Innovation Solution
An apparatus is provided with a first light source, a support structure, and an optical control mechanism to control light propagation, dissociating adhesive to transfer LED chips onto a to-be-transferred substrate, and includes additional features like a second light source for excitation and image capture for quality assessment.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If traditional mechanical transfer methods are used for LED chips, then the transfer process is simple, but the transfer precision and quality control are insufficient
Solution Approach 1:
The patent replaces traditional mechanical transfer methods with an optical-based system. A light source irradiates the load substrate, and an optical control mechanism (liquid crystal display or digital micromirror device) controls the propagation direction of light rays to selectively dissociate adhesive in target regions, enabling precise LED chip transfer without direct mechanical contact.
Solution Approach 2:
The patent introduces an optical control mechanism as an intermediary between the light source and the load substrate. This intermediary (liquid crystal display or digital micromirror device) modulates light propagation to achieve spatially selective adhesive dissociation, enabling precise control over which LED chips are transferred and where they are deposited.
2Reliability
If mass transfer of LED chips is performed without quality sorting, then the transfer efficiency is high, but the uniformity and stability of display quality deteriorates
Solution Approach 1:
The patent performs preliminary quality assessment of LED chips before transfer. An image capture mechanism captures images of LED chips on the load substrate, and a processing mechanism identifies quality characteristics. Based on this preliminary assessment, the system selectively transfers chips with similar quality to the same target substrate, ensuring display uniformity without sacrificing overall transfer efficiency.
Solution Approach 2:
The patent applies different transfer actions to different regions of the load substrate based on local quality characteristics of individual LED chips. The optical control mechanism enables selective dissociation of adhesive for specific chips, allowing high-quality chips to be transferred together while maintaining the ability to sort and separate chips of different qualities on the same substrate.
3Manufacturing precision
If selective transfer of individual LED chips is performed, then the quality control is precise, but the transfer time for each chip increases
Solution Approach 1:
The patent merges multiple transfer operations into a single unified process. The optical control mechanism can simultaneously control the transfer of multiple LED chips in one operation, and the image capture and processing mechanisms evaluate and sort multiple chips concurrently. This parallel processing approach maintains precise quality control while significantly reducing total transfer time compared to sequential individual chip transfer.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables precise and efficient transfer of LED chips with quality control, ensuring uniformity and stability in the display device by transferring chips of similar quality together.
Implementation Method 1
an optical control mechanism on a side of the light-transmissive substrate away from the LED chips and configured to control a propagation direction of the first light rays that irradiate onto the first radiation region of the optical control mechanism to form target light rays that irradiate onto a target radiation region of the load substrate, so that the dissociation adhesive in the target radiation region is dissociated
Implementation Method 2
a second light source configured to generate and emit second light rays, the second light rays passing through the optical control mechanism and irradiating onto the load substrate so as to excite the LED chips to emit light
Data Source
AI summary
The disclosure provides an apparatus for transferring LED chips, including: first light source configured to generate and emit first light rays; first support structure configured to carry load substrate, load substrate including light-transmissive substrate and the LED chips fixed on side of the light-transmissive substrate away from first light source by dissociation adhesive; second support structure configured to carry to-be-transferred substrate on side of the LED chips away from light-transmissive substrate; and optical control mechanism on side of light-transmissive substrate away from the LED chips and configured to control propagation direction of first light rays that irradiate onto first radiation region of the optical control mechanism to form target light rays that irradiate onto target radiation region of load substrate, so that dissociation adhesive in target radiation region is dissociated to transfer LED chips in target radiation region to to-be-transferred substrate.