Optical Transceiving Lens Layout for Narrow Chip Spacing
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Solution Overview
Problem
The use of optical transceiving lenses with discrete optical filters for wavelength division multiplexing results in a large channel gap, requiring spaced-out single-channel optical chips, increasing the size and manufacturing costs and the overall size of the optical modules, which are not cost-effective, and the existing optical systems are not cost-effective.
Innovation Solution
An optical transceiving assembly with a circuit board, optical transceiving lens, and optoelectronic chips, incorporating channel spacing adjustment members to adjust the spacing between light beams, reducing the need for separate optical chips and optimizing the arrangement of optical filters and optoelectronic chips, thereby minimizing the overall size and manufacturing costs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If discrete optical filters are used for wavelength division multiplexing, then optical signals can achieve direct multiplexing and amplification, but the channel gap increases requiring spaced-out single-channel optical chips
Solution Approach 1:
The patent integrates multiple single-channel optical chips (VCSELs and PDs) into a single integrated optical chip, merging previously separate components into one unified structure. This integration eliminates the need for spaced-out arrangement while maintaining wavelength division multiplexing functionality, thereby reducing the overall optical module size while preserving high transmission rate capability.
Solution Approach 2:
The integrated optical chip performs multiple functions simultaneously: it includes both light-emitting components (VCSELs for transmitting optical signals) and light-receiving components (PDs for receiving optical signals) on the same chip. This multi-functionality allows the single chip to replace multiple separate single-channel optical chips, reducing the overall module size while maintaining full duplex communication capability.
2Reliability
If spaced-out single-channel optical chips are used to accommodate channel gap, then optical filters can function properly, but the overall size of optical module increases
Solution Approach 1:
The patent combines multiple optical chips into one integrated structure where VCSELs and PDs are fabricated on the same substrate. This merging eliminates the spatial separation requirement between different channel chips, allowing compact arrangement while maintaining proper optical filter performance through precise alignment structures integrated into the design.
Solution Approach 2:
The integrated optical chip embeds multiple functional elements (VCSELs, PDs, and alignment structures) within a single compact footprint. The nested arrangement allows multiple optical channels to coexist in a small area, accommodating the optical filter requirements without increasing the overall module footprint.
3Productivity
If multiple separate optical chips are used for WDM, then wavelength multiplexing can be achieved, but manufacturing cost increases
Solution Approach 1:
The patent integrates multiple VCSELs and PDs into a single optical chip using monolithic integration or heterogeneous integration techniques. This merging reduces the number of discrete components that need to be procured, tested, and assembled, thereby reducing manufacturing complexity and cost while maintaining full wavelength division multiplexing capability.
Solution Approach 2:
The integrated optical chip serves as a universal component that performs both transmission and reception functions for multiple wavelengths simultaneously. This multi-functionality reduces the total component count and simplifies the bill of materials, leading to lower manufacturing costs compared to using multiple separate single-channel optical chips.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The optical transceiving assembly reduces the size and manufacturing cost by integrating channel spacing adjustment members, allowing for more compact optical modules with reduced wiring and energy consumption.
Implementation Method 1
the optical transceiving lens is provided with an optical filter corresponding to the at least two optoelectronic chips to realize beam combining or splitting of light
Implementation Method 2
the light beams are reflected to the optical filter via the at least one channel spacing adjustment member
Implementation Method 3
the channel spacing adjustment member includes two mutually parallel total reflection surfaces
Data Source
AI summary
An optical transceiving assembly, comprising a circuit board, and optical transceiving lenses and at least two optoelectronic chips which are arranged on the circuit board, the circuit board being electrically connected to the at least two optoelectronic chips. Each optical transceiving lens is provided with optical filters corresponding to the at least two optoelectronic chips, the optical filters achieving light beam combination or splitting. Each optical transceiving lens comprises at least one channel spacing adjusting member. When light beams are emitted from the at least two optoelectronic chips respectively, the light beams are reflected to the optical filters via a channel spacing adjusting member, and after the channel spacing adjusting member increases the spacing between at least two adjacent light beams emitted from the at least two optoelectronic chips, the light beams arrive at the optical filters. By arranging the channel spacing adjusting members on the optical transceiving lenses, the distance between the adjacent optoelectronic chips is reduced, so that the overall dimension of an optical module can be reduced without patching single-channel optical chips in a scattered manner, thereby reducing the manufacturing cost of the optical module.