Optical Member Fixing Structure with Stress-Absorbing Metal Layer

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Solution Overview

Problem

Existing optical member fixing structures fail to achieve high positioning accuracy due to insufficient consideration of stress relaxation properties, which is critical for downsized products with improved performance, especially when bonding optical members with adhesives.

Innovation Solution

Incorporating a metal layer with a yield stress equal to or less than the curing shrinkage or thermal stress of the adhesive, formed on the bonding surface between the optical member and the adhesive layer, with a thickness ranging from 0.3% to 10% of the adhesive layer's thickness after curing, to absorb deformation and maintain high positioning accuracy.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If a metal layer with appropriate yield stress and thickness is added to the bonding structure, then positioning accuracy is improved through stress absorption, but device complexity increases

Engineering Contradiction:
Improvepositioning accuracyVSAvoidstructure complexity
Core Design Contradiction:
Manufacturing precisionVSDevice complexity

Solution Approach 1:

A metal layer is introduced as an intermediary component between the optical member and the bonding object. This metal layer serves as a stress-absorbing intermediary that protects the optical member from deformation caused by adhesive curing shrinkage stress and thermal stress, thereby maintaining positioning accuracy without requiring direct modification of the optical member or bonding object

Inventive Principle:
Principle #24Intermediary (Mediator)

Solution Approach 2:

The invention changes the physical parameters of the bonding structure by selecting a metal layer with specific yield stress (equal to or less than the curing shrinkage stress or thermal stress of the adhesive) and specific thickness (0.3% to 10% of the adhesive layer thickness after curing). These parameter changes enable the metal layer to effectively absorb stress while maintaining structural integrity and positioning accuracy

Inventive Principle:
Principle #35Parameter changes

2Manufacturing precision

If the metal layer thickness is increased to improve stress absorption, then positioning accuracy is maintained, but manufacturing cost and process complexity increase

Engineering Contradiction:
Improvepositioning accuracyVSAvoidmanufacturing process simplicity
Core Design Contradiction:
Manufacturing precisionVSEase of manufacture

Solution Approach 1:

The invention defines a specific thickness range for the metal layer (0.3% to 10% of the adhesive layer thickness after curing) that optimizes the balance between stress absorption capability and manufacturing simplicity. This parameter specification ensures sufficient stress absorption for positioning accuracy while avoiding excessive thickness that would complicate manufacturing processes and increase costs

Inventive Principle:
Principle #35Parameter changes

Solution Approach 2:

The metal layer thickness is designed to be sufficient (at least 0.3% of adhesive layer thickness) to provide the necessary stress absorption effect, but not excessively thick. This partial action approach achieves the minimum effective thickness needed for positioning accuracy without over-engineering the structure, thereby simplifying manufacturing

Inventive Principle:
Principle #16Partial or excessive action

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The metal layer effectively absorbs curing shrinkage and thermal stresses, ensuring high positioning accuracy and long-term reliability of the optical member, even under temperature fluctuations, by maintaining a satisfactory bonding state and reducing positional shifts.

Implementation Method 1

a metal layer having a yield stress equal to or less than a curing shrinkage stress of an adhesive forming the adhesive layer

Methodology Applied
Scientific EffectYield stress: Plasticity

Implementation Method 2

a metal layer having a yield stress equal to or less than a thermal stress of an adhesive forming the adhesive layer

Methodology Applied
Scientific EffectThermal stress: Thermal Expansion

Data Source

PatentUS10901168B2Optical member fixing structure
Publication Date: 2021.01.26 MITSUBISHI ELECTRIC CORP
  • US10901168B2 patent drawing
  • US10901168B2 patent drawing
  • US10901168B2 patent drawing

AI summary

To achieve high positioning accuracy in an optical member fixing structure configured to bond an optical member, such as a lens, and a bonding object to each other with an adhesive layer, an optical member fixing structure in which a metal layer having a yield stress equal to or less than a curing shrinkage stress or a thermal stress of an adhesive forming an adhesive layer is formed on a bonding surface between at least one of an optical member or a bonding object and the adhesive layer to have a thickness of from 0.3% to 10% of a thickness of the adhesive layer after curing thereof.