Optical Memory Module with Photonic Interconnects for High Bandwidth
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Current semiconductor integrated circuits face challenges in achieving high memory bandwidth, particularly for AI and GPU applications, where insufficient memory capacity can degrade performance due to high memory access demands.
Innovation Solution
The implementation of an optical memory module with a substrate, memory controllers, and memory devices connected through optical interconnections, allowing optical communication with an optical logic module, utilizing photonic integrated circuits, electrical integrated circuits, and serializer-deserializer components to enhance memory access and bandwidth without the need for an interposer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If memory capacity is increased to meet AI and GPU demands, then memory bandwidth and performance are improved, but device complexity and power consumption increase
Solution Approach 1:
The patent segments the memory system into multiple independent memory devices (first memory devices and second memory devices) that can be independently controlled by separate memory controllers. This segmentation allows the system to achieve high memory bandwidth through parallel access to multiple memory devices while keeping each individual memory device and controller relatively simple, thus resolving the contradiction between high productivity and low device complexity
Solution Approach 2:
The patent implements a universal memory architecture where multiple memory controllers can access multiple memory devices through a shared substrate and interconnection structure. This multi-functional design allows the same substrate and control logic to manage different memory devices simultaneously, achieving high memory bandwidth without proportionally increasing overall device complexity
2Productivity
If memory capacity is increased using traditional packaging, then memory bandwidth is improved, but heat generation and power consumption increase
Solution Approach 1:
The patent segments the memory system into multiple independently controllable memory devices on a shared substrate, allowing heat to be distributed across multiple smaller components rather than concentrated in a single large memory block. This segmentation enables better thermal management while maintaining high memory bandwidth through parallel access to multiple memory devices
Solution Approach 2:
The patent transitions from traditional two-dimensional packaging to a three-dimensional architecture where multiple memory devices are arranged on a shared substrate with vertical interconnections. This dimensional change allows for better heat dissipation pathways and more efficient use of space, achieving high memory bandwidth without proportional increases in heat generation
3Productivity
If memory capacity is increased using traditional electrical interconnections, then memory bandwidth is improved, but manufacturing cost and device size increase
Solution Approach 1:
The patent replaces traditional electrical interconnections with optical interconnections using photonic integrated circuits. This substitution eliminates the need for complex electrical wiring and interposers, significantly reducing manufacturing cost and device size while achieving high memory bandwidth through optical signal transmission between memory devices and controllers
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution efficiently expands memory capacity and bandwidth, reduces manufacturing costs, and addresses issues like heat generation, power consumption, and size constraints by enabling separate packaging of processing and memory devices connected via optical links, thereby improving performance in high-demand computing applications.
Implementation Method 1
The photonic integrated circuit converts a first optical input signal to a first electrical input signal or converts a first electrical output signal to a first optical output signal
Data Source
AI summary
An optical memory module includes a substrate, a first memory controller on the substrate, and a plurality of first memory devices on the substrate. The first memory controller includes the first transceiver. The first transceiver receives a first optical input signal through a first optical interconnection or outputs a first optical output signal through the first optical interconnection. The first memory controller is optically connected to an optical logic module located outside the optical memory module through the first transceiver and the first optical interconnection. The plurality of first memory devices are controlled by the first memory controller and accessed by the optical logic module through the first memory controller, the first transceiver and the first optical interconnection.