Modular Optical Mesh Assembly for Spine-Leaf Network Scaling
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Solution Overview
Problem
Traditional three-tier switch architectures in data centers, such as Core, Aggregation, and Access (CAA), fail to provide low and equalized latency channels for East-West traffic, underutilize network capacity, and require complex, costly mesh networks with numerous fibers and connectors in Spine-and-Leaf architectures.
Innovation Solution
A modular optical interconnection assembly with Spine and Leaf multi-fiber connectors, using sub-meshes to simplify deployment and scaling of Spine-and-Leaf networks by reducing fiber complexity and enabling flexible network configurations.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If traditional three-tier CAA architecture is used, then network capacity is underutilized and latency is high, but implementing Spine-and-Leaf architecture requires complex mesh with large numbers of fibers and connectors
Solution Approach 1:
The patent divides the complex Spine-and-Leaf mesh network into modular optical interconnection assemblies, where each assembly contains a subset of connections. This segmentation allows the network to achieve full mesh connectivity functionality while reducing installation complexity and enabling phased deployment.
Solution Approach 2:
The patent pre-configures optical interconnection assemblies with specific mesh patterns before deployment. These pre-assembled units contain predetermined fiber connections that match required network topologies, eliminating the need for complex on-site mesh construction and reducing installation errors.
2Speed
If Spine-and-Leaf architecture is implemented with full mesh connectivity, then bandwidth and latency performance improve, but installation cost and complexity increase
Solution Approach 1:
The patent segments the full mesh connectivity requirement into multiple standardized optical interconnection assemblies, each handling a portion of the total connections. This allows parallel installation processes and reduces the skill level required for individual installers while maintaining overall high-speed connectivity.
Solution Approach 2:
The patent standardizes connection parameters within optical interconnection assemblies, such as fiber counts, connector types, and routing patterns. This standardization enables mass production of pre-configured units and simplifies installation procedures while preserving the high-bandwidth, low-latency performance of full mesh topology.
3Manufacturing precision
If custom transpose boxes are designed for specific network topologies, then deployment accuracy improves, but adaptability to different configurations decreases
Solution Approach 1:
The patent designs optical interconnection assemblies with universal interfaces and standardized connection patterns that can be configured for multiple network topologies. The same basic assembly type can serve different Spine-and-Leaf configurations by changing the internal fiber routing or connection mapping, eliminating the need for custom-designed boxes for each topology.
Solution Approach 2:
The patent incorporates dynamic configuration capabilities within standardized assemblies, allowing the connection mapping to be adjusted or reconfigured based on the specific network topology requirements. This enables a single assembly design to adapt to various deployment scenarios while maintaining precise connection accuracy.
Data Source
AI summary
An optical interconnection assembly has Spine multi-fiber optical connectors and Leaf multi-fiber optical connectors. The Spine optical connectors of the interconnection assembly are optically connected to multi-fiber connectors of Spine switches via Spine patch cords. The Leaf multi-fiber connectors are optically connected to Leaf multi-fiber connectors of Leaf switches via Leaf patch cords. A plurality of fiber optic cables in said interconnection assembly serves to optically connect every Spine multi-fiber connector to every Leaf multi-fiber connector so that every Spine switch is optically connected to every Leaf switch. The optical interconnection assembly facilitates the deployment of network Spine-and-Leaf interconnections and the ability to scale out the network by using simplified methods described in this disclosure.