Optical Component Microstrip Transfer Board Impedance Matching
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
In optical components, the impedance matching for high-frequency signal transmission is challenging due to long wire bonding lengths and inductance characteristics, leading to impedance mismatching and limited transmission bandwidth.
Innovation Solution
The optical component employs a microstrip line structure on a transfer board, with transfer lines connecting the first electrically conductive path to the laser, ensuring controlled characteristic impedance and minimizing wire bonding length, thereby addressing impedance mismatching and enhancing high-frequency signal transmission.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If traditional PCB electrically conductive paths are used to supply electric energy to the laser, then the structure is simple and easy to manufacture, but the impedance matching for high-frequency signal transmission deteriorates due to long wire bonding lengths and inductance characteristics
Solution Approach 1:
The patent introduces a transfer board with microstrip line structures as an intermediary component between the PCB and the laser. The transfer board includes a first electrically conductive path on its first surface that connects to the PCB, and a second electrically conductive path on its second surface that connects to the laser. This intermediary structure enables impedance transformation and matching, resolving the contradiction between manufacturing simplicity and impedance matching performance for high-frequency signals.
2Ease of operation
If wire bonding length is increased to connect PCB to laser, then the connection is more flexible and easier to implement, but the inductance increases causing impedance mismatching and limited transmission bandwidth
Solution Approach 1:
The patent transitions from a planar connection approach to a three-dimensional layered structure by introducing the transfer board with microstrip lines. The first electrically conductive path is disposed on the first surface of the transfer board, while the second electrically conductive path is disposed on the second surface, creating a vertical dimension that reduces wire bonding length and inductance while maintaining connection flexibility.
3Volume of moving object
If miniaturization is pursued in optical components, then the device size is reduced, but the impedance matching becomes more difficult due to constrained space for electrically conductive paths
Solution Approach 1:
The transfer board with microstrip line structures is integrated within the compact optical component structure, nesting the impedance matching functionality inside the miniaturized device. The first and second electrically conductive paths are disposed on opposite surfaces of the transfer board, allowing efficient use of vertical space and achieving impedance matching without increasing the overall device volume.
Data Source
AI summary
An optical component includes: a first substrate, a second substrate, and a transfer board. A first electrically conductive path is disposed on a top surface of the first substrate. A second electrically conductive path is disposed on a bottom surface of the first substrate. A third electrically conductive path is disposed on a top surface of the second substrate. A microstrip line structure is disposed on the transfer board. The microstrip line structure includes a transfer line disposed on a top surface of the transfer board. The top surface of the second substrate is opposite to the bottom surface of the first substrate, where the second electrically conductive path fits the third electrically conductive path. The transfer board is disposed on the top of the top surface of the second substrate. One end of the transfer line is electrically connected to the first electrically conductive path by a wire bonding.