Optical Modulator Buffer Layer Overlap
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Solution Overview
Problem
Existing optical modulators using thin film technology face issues such as long manufacturing processes, temperature changes due to heat treatment, exposure to water during singulation, and low reliability due to stress-related peeling or cracking at the boundary between buffer layers.
Innovation Solution
The optical modulator features a substrate with an optical waveguide, a signal electrode, and a bias electrode, where the first and second buffer layers are formed such that one covers the end surface of the other at their boundary, creating a highly reliable structure with no peeling or cracking, and improving product yield.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If the first buffer layer and the second buffer layer are arranged parallel to the main surface of the substrate with their end surfaces contacting each other, then the manufacturing process is simplified, but the boundary between the buffer layers is prone to peeling or cracking due to stress
Solution Approach 1:
The patent transitions from a two-dimensional parallel arrangement to a three-dimensional overlapping configuration where the first buffer layer extends beyond the second buffer layer in the planar direction. This dimensional change creates a staggered joint structure that distributes stress across a larger area, preventing peeling and cracking at the buffer layer boundary while maintaining manufacturing simplicity.
2Volume of moving object
If thin film technology is used to form the optical waveguide on a sapphire substrate, then device miniaturization and low driving voltage are achieved, but the manufacturing process becomes long and complex with temperature changes and exposure to water
Solution Approach 1:
The patent applies preliminary protective measures by designing an overlapping buffer layer structure before the final device assembly. This preliminary structural optimization prevents stress concentration and potential failure points from forming during subsequent manufacturing steps, thereby reducing the need for additional protective processes and simplifying the overall manufacturing workflow.
3Quantity of substance
If the buffer layers are formed with their end surfaces contacting each other, then material usage is minimized, but stress concentration occurs at the boundary leading to peeling or cracking
Solution Approach 1:
The patent creates a composite buffer layer structure where the first and second buffer layers overlap to form a staggered configuration. This composite arrangement combines the advantages of both layers while distributing mechanical stress across the overlapping region, preventing stress concentration and enhancing the overall strength and reliability of the buffer layer system.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enhances the reliability and stability of the optical modulator, reducing the likelihood of manufacturing defects and improving the overall performance and longevity of the device.
Implementation Method 1
optical fiber communication is a technology that converts an electric signal into an optical signal and transmits the optical signal through an optical fiber
Implementation Method 2
an optical modulator using an optical waveguide formed by lithium niobate (LiNbO3) has the advantages of high speed, low loss and less distortion of controlling light waveform
Data Source
AI summary
An optical modulators is disclosed. The optical modulator includes a substrate, an optical waveguide formed on the substrate, a signal electrode formed on the optical waveguide via a first buffer layer and applying a modulation signal to the optical waveguide, and a bias electrode formed on the optical waveguide via a second buffer layer and applying a DC bias to the optical waveguide, the first buffer layer and the second buffer layer are formed in such a way that either one of the first buffer layer and the second buffer layer covers an end surface of the other one of the first buffer layer and the second buffer layer at a boundary part of the first buffer layer and the second buffer layer. Accordingly, an optical modulator with high reliability can be provided.