Optical Modulator Heat Dissipation for DP-QPSK Reliability
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Solution Overview
Problem
High-speed, large-capacity optical fiber communication systems face significant heat generation issues in optical modulators with traveling wave type electrodes, particularly in DP-QPSK configurations, leading to temperature drift, reliability deterioration, and increased production costs due to the large number of terminal resistors and small size constraints.
Innovation Solution
The optical modulator incorporates a heat dissipation auxiliary element between terminal resistors and the housing, with a shorter distance between the resistors and the auxiliary element to efficiently dissipate heat, using materials like metal foils, bonding wires, thermally conductive adhesives, or vias to reduce heat conduction to the optical waveguide substrate.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Speed
If terminal resistors are disposed on the terminal substrate to terminate modulation signals, then the optical modulator can operate at high speeds with multi-level modulation, but heat is generated in the terminal resistors causing temperature drift and reliability deterioration
Solution Approach 1:
The patent extracts the heat dissipation function from the terminal substrate by introducing a dedicated heat dissipation auxiliary element. This separate component is specifically designed to remove heat from the terminal resistors, allowing the terminal substrate to focus on its primary function of signal termination and electrical connection, thereby resolving the contradiction between high-speed operation and reliability
Solution Approach 2:
The heat dissipation auxiliary element acts as an intermediary between the terminal resistors and the housing. It mediates the heat transfer process by providing a dedicated thermal conduction path that isolates the heat generation from the sensitive optical components while efficiently transferring heat to the housing for dissipation, thus maintaining reliability during high-speed operation
2Volume of moving object
If the terminal substrate is disposed in the vicinity of the optical waveguide substrate to reduce size, then the optical modulator size is reduced, but heat generated in the terminal substrate affects the optical waveguide substrate causing temperature drift
Solution Approach 1:
The heat dissipation auxiliary element serves as a thermal intermediary positioned between the terminal resistors and the housing. It provides a preferential heat conduction path that directs heat away from the optical waveguide substrate and toward the housing, allowing compact arrangement while maintaining temperature stability through controlled thermal management
Solution Approach 2:
The patent applies local quality by creating a specialized heat dissipation zone around the terminal resistors using the heat dissipation auxiliary element. This localized thermal management structure concentrates heat dissipation capability at the heat source location, enabling close proximity arrangement of substrates without compromising overall temperature stability
3Productivity
If multiple terminal resistors are provided on the same terminal substrate to support DP-QPSK modulation, then transmission capacity is increased, but the amount of heat generated increases significantly
Solution Approach 1:
The patent segments the heat dissipation function from the terminal substrate by introducing a dedicated heat dissipation auxiliary element. This allows multiple terminal resistors to be arranged on the terminal substrate to support high-capacity DP-QPSK modulation while the separate heat dissipation element collectively manages the heat from all resistors, enabling high productivity without excessive energy loss as heat
Solution Approach 2:
The heat dissipation auxiliary element provides a universal heat dissipation solution that serves all terminal resistors simultaneously. This multi-functional component handles heat from multiple resistors through a single integrated structure, allowing the system to achieve high transmission capacity while efficiently managing the cumulative heat generation from all resistors
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration effectively reduces heat generation in terminal resistors, stabilizes temperature drift, and enhances the reliability of optical modulators and transmission devices by efficiently dissipating heat, while maintaining a compact size and low production costs.
Implementation Method 1
a heat dissipation auxiliary element is provided between the terminal resistor and the housing
Implementation Method 2
An optical modulator in which LiNbO3 (referred to as 'LN') having an electrooptic effect is used for a substrate
Data Source
AI summary
An optical modulator and an optical transmission device using the same are provided. The optical modulator includes an optical waveguide substrate where an optical waveguide is formed; a light modulation element, provided in the optical waveguide substrate and including a modulation electrode applying an electric field corresponding to a modulation signal to the optical waveguide; a terminal substrate, disposed near the light modulation element and including terminal resistors that terminate the modulation signal, wherein the optical waveguide substrate, the light modulation element and the terminal substrate are accommodated in a housing; and a heat dissipation auxiliary element, provided between the terminal resistors and the housing. A distance b between the terminal resistors and the heat dissipation element is set to be shorter than a distance a from the terminal resistors to an end on the side of the optical waveguide substrate of the terminal substrate.