Optical Modulator Housing Layout for Signal Loss Reduction
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Solution Overview
Problem
In optical communication modules, the integration of optical modulators and driver circuits in a narrow space leads to complex signal propagation and performance deterioration due to high-frequency signal handling challenges, necessitating a solution to suppress propagation loss while achieving miniaturization.
Innovation Solution
The optical communication module design includes an optical modulator with an optical modulation element housed in a rectangular parallelepiped container, a driver circuit that inputs high-frequency signals, and a housing with an electrical interface on one side and an optical interface on the opposite side, featuring a wiring substrate that introduces signals from a short-side side, with the driver circuit positioned between the modulator and electrical interface to minimize signal loss.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If optical modulator and driver circuit are integrally disposed in a narrow space to achieve miniaturization, then the optical communication module size is reduced, but the propagation loss of high-frequency signal increases and performance deteriorates
Solution Approach 1:
The optical modulator is segmented from the driver circuit by providing separate housings for each component. The optical modulator housing and driver circuit housing are disposed adjacently with their short-side sides facing each other, creating distinct functional zones that reduce signal interference and propagation loss while maintaining compact overall size.
Solution Approach 2:
A wiring substrate serves as an intermediary element between the optical modulator and driver circuit. The wiring substrate is configured to introduce high-frequency signals from the driver circuit to the optical modulator through a relay substrate, minimizing direct connection complexity and signal path length while maintaining electrical isolation between the two main components.
2Volume of moving object
If optical modulator and driver circuit are disposed close together to reduce module size, then miniaturization is achieved, but connection complexity and handling of interconnections increase
Solution Approach 1:
The wiring substrate and relay substrate are merged into an integrated connection structure that combines signal transmission and component mounting functions. This unified substrate design simplifies the interconnection between optical modulator and driver circuit by providing pre-configured electrical pathways and reducing the number of separate connection elements required.
Solution Approach 2:
The relay substrate acts as an intermediary between the wiring substrate and optical modulator, providing a standardized interface that simplifies signal routing. This intermediate layer abstracts the complexity of direct connections, making the overall system easier to assemble and maintain while keeping the module compact.
Data Source
AI summary
An optical communication module includes: an optical modulator that includes an optical modulation element housed in a rectangular parallelepiped container; a driver circuit that inputs a high-frequency signal to the optical modulation element; and a housing that houses the optical modulator and the driver circuit. An electrical interface is provided on one lateral surface of the housing, and an optical interface is provided on another lateral surface, which is opposite to the lateral surface, of the housing. In the optical modulator, an end of a wiring substrate, which is configured to introduce the high-frequency signal to the optical modulation element, is led out from one short-side side of the rectangular parallelepiped container, and the driver circuit is disposed between the short-side side of the optical modulator and the electrical interface.