Optical Modulator Lead Pin Resonance Suppression
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Solution Overview
Problem
The existing optical modulators face challenges in maintaining connection strength during wire bonding, particularly in miniaturized DP-QPSK modulators, leading to potential bonding failures and reliability issues due to resonance phenomena caused by vibration during the bonding process.
Innovation Solution
The optical modulator design incorporates lead pins with varying natural frequencies by adjusting their length, width, thickness, material, or position, ensuring that at least partial lead pins have different resonance characteristics compared to others, thereby reducing resonance and enhancing connection reliability during wire bonding.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If lead pins are fixed to the housing in a miniaturized optical modulator, then the device size is reduced and integration density is improved, but resonance phenomena occur during wire bonding that deteriorate connection strength
Solution Approach 1:
The patent applies local quality by making each lead pin have different dimensions (length, width, thickness) or material properties, so that each pin has a unique natural frequency. This local differentiation prevents resonance during wire bonding while maintaining overall device miniaturization. The lead pins are locally customized rather than using uniform pins throughout the device.
Solution Approach 2:
The patent changes physical parameters of the lead pins, specifically their dimensions (length, width, thickness) and material composition, to adjust their natural frequencies. By varying these parameters, the patent ensures that lead pins do not resonate at the wire bonding frequency, thereby preventing connection strength deterioration while maintaining compact device size.
2Ease of manufacture
If uniform lead pins are used in the optical modulator, then manufacturing complexity is reduced and production cost is lowered, but resonance-induced vibration energy propagates causing bonding failures
Solution Approach 1:
Instead of using uniform lead pins throughout the device, the patent implements local quality by varying the dimensions and/or materials of individual lead pins. This creates different natural frequencies for each pin, preventing resonance propagation. While this increases manufacturing complexity compared to uniform pins, it significantly improves bonding reliability by eliminating the resonance issue.
3Reliability
If lead pins are made with varying dimensions and materials to prevent resonance, then bonding reliability is improved, but manufacturing precision requirements increase
Solution Approach 1:
The patent changes the physical parameters of lead pins (dimensions and materials) to achieve different natural frequencies. While this requires manufacturing precision to ensure the parameters are correctly implemented, the precision requirements are manageable through standard manufacturing tolerances. The key is to achieve sufficient frequency differentiation rather than extreme precision.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach effectively suppresses the deterioration of connection strength in wire bonding, preventing bonding failures and ensuring reliable operation of the optical modulator by minimizing resonance-induced vibration energy propagation.
Implementation Method 1
a natural frequency of at least partial lead pins among the plurality of lead pins is different from a natural frequency of the other lead pins... effectively suppresses the deterioration of connection strength in wire bonding, preventing bonding failures and ensuring reliable operation of the optical modulator by minimizing resonance-induced vibration energy propagation
Data Source
AI summary
Provided is an optical modulator in which an optical modulation element is accommodated in a housing. A plurality of lead pins, which are electrically connected to the optical modulation element through wire bonding, are fixed to the housing in a manner of protruding at least a part of each of the plurality of lead pins into the housing. In the plurality of lead pins, lengths of the lead pins are set to be different from each other so that a natural frequency of at least partial lead pins is different from a natural frequency of the other lead pins.