Optical Modulator Package Protrusions for Heat Dissipation
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Solution Overview
Problem
The downsizing of optical modulators for short-distance applications leads to heat dissipation issues, causing temperature rises and reliability concerns due to increased space utilization and proximity of heat-generating components in optical transmission devices.
Innovation Solution
The optical modulator features a package case with protrusion portions on its external surface, opposite to the termination resistor board, made of a material with lower thermal resistance, enhancing heat dissipation by increasing the surface area and allowing efficient heat transfer to a conductor pattern on a circuit board.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If the package case is downsized to reduce installation space, then the space utilization rate is improved, but the heat dissipation performance deteriorates causing temperature rise
Solution Approach 1:
The package case incorporates protrusion portions that extend in the vertical dimension (thickness direction) rather than expanding the horizontal footprint. This allows heat dissipation surface area to be increased without increasing the planar installation space, resolving the contradiction between compact footprint and effective heat dissipation.
Solution Approach 2:
The package case is segmented into functional regions including protrusion portions that are specifically designed for heat dissipation. These protrusion portions act as separate heat dissipation structures distinct from the main package body, allowing optimized thermal management without compromising the compact overall design.
2Productivity
If the space utilization rate is increased by downsizing, then the integration density is improved, but the heat dissipation capability deteriorates
Solution Approach 1:
The protrusion portions utilize the vertical dimension to provide additional heat dissipation pathways without consuming horizontal space. This enables high integration density while maintaining adequate heat dissipation capability through three-dimensional heat transfer paths.
Solution Approach 2:
The protrusion portions are strategically positioned at specific locations on the package case where heat dissipation is most critical. These localized structures provide enhanced thermal management exactly where needed, allowing high integration density without compromising heat dissipation at key thermal sources.
3Volume of moving object
If the package case is downsized, then the device size is reduced, but the heat generation from termination resistors causes non-negligible temperature rise
Solution Approach 1:
The protrusion portions extend in the thickness direction to create additional heat dissipation surfaces. This vertical dimensionality allows the compact device to have sufficient heat dissipation area without increasing its planar footprint, preventing temperature rise despite small device size.
Solution Approach 2:
The protrusion portions act as intermediary heat dissipation structures between the termination resistors (heat sources) and the external environment. These intermediate structures provide dedicated thermal pathways that efficiently transfer heat away from the compact device, preventing temperature accumulation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration effectively dissipates heat generated within the optical modulator, preventing temperature rises and ensuring stable and reliable operation of the optical transmission device.
Implementation Method 1
at least one of the protrusion portions is formed at a position on the external surface of the package case, the position opposite to a position inside the package case where the termination resistor board is disposed with the package case in between
Data Source
AI summary
An optical modulator that can effectively dissipate heat generated from the inside includes: an optical modulation element which includes an optical waveguide and a radio frequency electrode for controlling light waves propagating through the optical waveguide; a termination resistor electrically connected to the radio frequency electrode; a termination resistor board on which the termination resistor is disposed; and a package case, which houses the optical modulation element and the termination resistor board, in which a plurality of protrusion portions are formed on one external surface of the package case, and at least one of the protrusion portions is formed at a position on the external surface of the package case, which faces a position inside the package case where the termination resistor board is disposed with the package case in between.