Optical Modulator Relay Substrate Noise Suppression

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Solution Overview

Problem

In optical modulators with relay substrates for inputting radio frequency signals, radiation noise generated from electrical connection portions between lead pins and the relay substrate affects the modulation operation, leading to propagation characteristics deterioration.

Innovation Solution

The optical modulator design features conductor patterns on the relay substrate with narrower gaps on the optical modulator-side edge compared to the lead pin-side edge, reducing radiation noise coupling by minimizing the effective reception area for electromagnetic radiation.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If lead pins are connected to the relay substrate with standard conductor pattern spacing, then electrical connection is achieved, but radiation noise is generated that deteriorates modulation operation

Engineering Contradiction:
Improvemodulation operation stabilityVSAvoidradiation noise
Core Design Contradiction:
ReliabilityVSObject-affected harmful factors

Solution Approach 1:

The patent applies different gap widths for conductor patterns at different locations on the relay substrate. Specifically, the gap width is set to 0.5mm or less in regions where radiation noise suppression is critical (near lead pin connection portions), while other regions may have larger gap widths. This local differentiation of conductor pattern properties effectively suppresses radiation noise without compromising overall electrical connection functionality.

Inventive Principle:
Principle #3Local quality

2Ease of manufacture

If conductor patterns on relay substrate have larger gap widths, then manufacturing is easier, but radiation noise coupling increases

Engineering Contradiction:
Improveconductor pattern fabricationVSAvoidradiation noise coupling
Core Design Contradiction:
Ease of manufactureVSObject-affected harmful factors

Solution Approach 1:

The patent implements local quality by specifying that gap widths of conductor patterns be 0.5mm or less in specific critical regions on the relay substrate where radiation noise suppression is most important, particularly near the lead pin connection portions. This localized approach balances manufacturing feasibility with effective radiation noise suppression.

Inventive Principle:
Principle #3Local quality

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This configuration effectively suppresses radiation noise, enhancing the resistance to noise interference and maintaining stable optical modulation performance.

Implementation Method 1

conductor patterns that electrically connect the lead pins with the signal electrodes

Methodology Applied
Scientific EffectElectrical conduction: Conduction (electrical)

Implementation Method 2

optical modulation element in which LiNbO3 (hereinafter, also referred to as LN) having an electro-optic effect is used

Methodology Applied
Scientific EffectElectro-optic effect: Electro-Optic Effects

Data Source

PatentUS10061179B2Optical modulator and optical transmission apparatus
Publication Date: 2018.08.28 SUMITOMO OSAKA CEMENT CO LTD
  • US10061179B2 patent drawing
  • US10061179B2 patent drawing
  • US10061179B2 patent drawing

AI summary

An optical modulator includes an optical modulation element including a plurality of signal electrodes and the like, a plurality of lead pins and the like for inputting radio frequency signals, and a relay substrate in which conductor patterns and the like that electrically connect the lead pins with the signal electrodes respectively are formed, the relay substrate is disposed so that a propagation direction of the radio frequency signals that have propagated through the lead pins is bent and guided to the conductor patterns, and the relay substrate is constituted so that widths of gaps between the plurality of conductor patterns in the optical modulator-side edge of the relay substrate is smaller than, preferably smaller than 50% of widths of gaps between the plurality of conductor patterns in the lead pin-side edge.