Optical Modulator Resonance Suppression
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Solution Overview
Problem
In optical modulators with multiple lead pins, the connection strength of wire bonding can deteriorate due to resonance issues during assembly and operation, leading to potential catastrophic failures in optical communication systems, especially in miniaturized designs where vibration energy is not adequately attenuated.
Innovation Solution
The implementation of a resonance suppressing structure on the lateral wall of the housing, featuring concave or convex portions or heterogeneous materials, to absorb or disperse vibration energy and prevent resonance among lead pins, thereby maintaining connection strength and reliability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the housing is miniaturized to reduce size, then the optical modulator achieves compact design, but vibration energy is not adequately attenuated leading to resonance and deteriorated wire bonding connection strength
Solution Approach 1:
A vibration attenuating structure is introduced as an intermediary component between the lead pins and the housing. This mediator absorbs and attenuates vibration energy, preventing it from reaching the wire bonding connection points. The structure includes vibration attenuating portions that specifically target and dampen resonant frequencies, thereby protecting the wire bonding connections from deterioration while maintaining the miniaturized housing design.
Solution Approach 2:
The vibration attenuating structure is designed to provide beforehand cushioning against resonance effects. By pre-positioning damping materials and vibration attenuating portions at strategic locations within the housing, the system prepares for and mitigates vibration energy before it can cause damage to the wire bonding connections. This proactive approach allows compact housing design without compromising connection reliability.
2Device complexity
If multiple lead pins are densely arranged to achieve high-density configuration, then the optical modulator achieves compact design, but resonance between lead pins occurs leading to deteriorated connection strength
Solution Approach 1:
Vibration attenuating portions are positioned between adjacent lead pins to act as intermediaries that block and absorb vibration energy. These portions prevent vibration from one lead pin from transmitting to neighboring lead pins, thereby eliminating resonance effects even in high-density configurations. The attenuating structure serves as a barrier that maintains connection strength despite close spacing of multiple lead pins.
3Ease of manufacture
If wire bonding is performed on lead pins in a hollow cantilevered state, then the manufacturing process is simplified, but connection strength deteriorates due to resonance during assembly and operation
Solution Approach 1:
The vibration attenuating structure serves as a mediator that protects the wire bonding connection points from resonance-induced deterioration. By placing damping materials and attenuating portions at strategic locations near the lead pins, the system maintains the simplified hollow cantilevered configuration while preventing vibration from compromising connection strength. The attenuating structure absorbs energy before it can reach the bonding points.
Solution Approach 2:
The vibration attenuating structure provides beforehand cushioning by pre-positioning damping elements that will absorb resonance energy during assembly and operation. This allows the wire bonding to be performed on the simple hollow cantilevered lead pins while ensuring that connection strength is protected from future resonance effects through the pre-installed attenuating portions.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach effectively suppresses resonance-induced vibration in lead pins, ensuring stable connection strength and reliability in wire bonding, even in miniaturized optical modulators, by attenuating or dispersing vibration waves along the housing surfaces.
Implementation Method 1
a resonance suppressing structure, which is configured to suppress resonance between the lead pins, is provided in a lateral wall portion to which the plurality of lead pins are fixed
Implementation Method 2
attenuating or dispersing vibration waves along the housing surfaces
Data Source
AI summary
An optical modulator includes an optical modulation element that is accommodated in a housing. A plurality of lead pins, which are electrically connected to the optical modulation element through wire bonding, are fixed to a lateral wall of the housing. Each of the plurality of lead pins includes a portion that protrudes into an inner space (inner surface side) of the housing. A resonance suppressing structure (for example, a concave portion), which is configured to suppress resonance between the lead pins, is provided in a lateral wall portion to which the plurality of lead pins are fixed.