Optical Modulator Assembly With Deformable TEC Adhesive Layer
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Solution Overview
Problem
The warpage of the TEC due to thermal expansion causes stress on the optical modulation element, leading to poor adhesion and potential electrical disconnection in flip-chip connections.
Innovation Solution
A deformable adhesive layer, such as silicone resin, is used to connect the TEC and optical modulation element, allowing deformation in response to stress, preventing warpage-induced deformation of the optical modulation element.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If a thermosetting fixing material is used to rigidly fix the TEC to the optical modulation element, then the connection strength is improved, but the optical modulation element is subjected to stress from TEC warpage causing adhesion failure and electrical disconnection
Solution Approach 1:
The patent changes the physical parameters of the adhesive layer by using a deformable material with appropriate viscosity and elasticity characteristics. This allows the adhesive to maintain connection strength while accommodating TEC warpage through controlled deformation, preventing stress transmission to the optical modulation element and ensuring electrical connection reliability
Solution Approach 2:
The patent employs a composite approach by combining the rigid TEC structure with a deformable adhesive layer that has specific mechanical properties. This composite structure allows the rigid component (TEC) to provide thermal control while the deformable adhesive absorbs dimensional changes, resolving the contradiction between strong fixation and stress prevention
2Stability of the object's composition
If the TEC is rigidly fixed to the optical modulation element, then the thermal control stability is improved, but the warpage stress causes deformation of the optical modulation element
Solution Approach 1:
The deformable adhesive layer serves as an intermediary between the TEC and the optical modulation element. It transmits thermal control functions from the TEC while simultaneously absorbing mechanical stress from warpage, preventing direct stress transmission that would cause deformation of the optical modulation element and maintaining both thermal stability and shape integrity
3Reliability
If a deformable adhesive layer is used to accommodate TEC warpage, then the stress on the optical modulation element is reduced, but the connection strength may be compromised
Solution Approach 1:
The patent optimizes the physical parameters of the deformable adhesive layer, specifically controlling its viscosity and elasticity characteristics. This allows the adhesive to exhibit sufficient strength for reliable connection while maintaining the ability to deform and accommodate TEC warpage, thus simultaneously achieving connection reliability and stress reduction
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Prevents deformation of the optical modulation element, maintaining stable connections and reducing the risk of electrical disconnection, even with TEC warpage.
Implementation Method 1
a deformable adhesive layer that connects the temperature controller and the optical modulation element on a surface different from the heat spreader and is deformable in response to stress caused by deformation of the temperature controller
Implementation Method 2
the TEC is configured with Peltier elements having a heat absorbing surface and a heat radiating surface
Implementation Method 3
the TEC may be warped due to a difference in thermal expansion of a material corresponding to a temperature difference between the heat absorbing surface and the heat radiating surface
Data Source
AI summary
An object of the present invention is to provide a light modulation device capable of preventing deformation of an optical modulation element due to warpage of a TEC. The light modulation device of the present invention includes an optical modulation element that is flip-chip connected on a high-frequency wiring substrate, a temperature controller that controls a temperature of the optical modulation element, a heat spreader that is connected to the temperature controller, and a deformable adhesive layer that connects the temperature controller and the optical modulation element on a surface different from the heat spreader and is deformable in response to stress caused by deformation of the temperature controller