Optical Modulator Substrate Via Grounding for Slotline Suppression
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Solution Overview
Problem
Conventional optical modulators face challenges in suppressing the high-frequency electrical propagation mode (slotline mode) and achieving broadband implementation, especially when integrating high EO materials into silicon photonics devices.
Innovation Solution
The optical device incorporates a substrate with an optical modulating unit featuring multiple electrodes for modulating optical signals, vias extending through the substrate to connect ground electrodes, and a second-surface electrode connected to the vias, which effectively suppresses the slotline mode by ensuring proper ground connections.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If ground electrodes are connected using conventional methods (bonding wire or ground shield), then slotline mode suppression is achieved, but device complexity and manufacturing difficulty increase
Solution Approach 1:
The invention extracts the ground connection function from complex external structures (bonding wires, ground shields) and integrates it directly into the substrate through vias. The ground electrodes are connected to a ground potential through substrate vias, eliminating the need for separate bonding wires or ground shield structures, thereby simplifying the overall device while maintaining slotline mode suppression.
Solution Approach 2:
The invention merges the ground electrode connection function with the substrate structure itself. By forming vias through the substrate to connect ground electrodes to a ground potential, the substrate serves dual purposes: as the mechanical support structure and as the ground connection pathway, consolidating multiple functions into a single integrated structure.
2Speed
If high EO materials are integrated into silicon photonics devices, then modulation speed is improved, but slotline mode conversion occurs and broadband implementation is hindered
Solution Approach 1:
The invention applies different electrode configurations to different regions of the device. In the optical modulating unit, electrodes are arranged to modulate optical signals, while separate ground electrodes are positioned to suppress slotline mode. This localized optimization allows the high EO material region to achieve fast modulation while the ground electrode regions maintain broadband compatibility by preventing mode conversion.
3Productivity
If more optical transmission equipment is installed to expand transmission capacity, then transmission capacity increases, but device size increases
Solution Approach 1:
The invention nests multiple functional elements within the substrate structure itself. The optical modulating unit, ground electrodes, vias, and ground potential connections are all integrated within the substrate, creating a compact nested structure where one function is contained within another, thereby increasing transmission capacity without proportionally increasing device size.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enhances the suppression of high-frequency electrical propagation mode conversion, thereby improving the optical modulation characteristics and enabling broadband implementation.
Implementation Method 1
a plurality of vias extending in a thickness direction of the substrate and connected to a plurality of ground electrodes included in the plurality of electrodes
Implementation Method 2
an optical modulating unit provided in the substrate, at the first surface, the optical modulating unit having a plurality of electrodes for modulating an optical signal
Data Source
AI summary
An optical device includes: a substrate having a first surface and a second surface opposite to each other; an optical modulating unit provided in the substrate, at the first surface, the optical modulating unit having a plurality of electrodes for modulating an optical signal; a plurality of vias extending in a thickness direction of the substrate and connected to a plurality of ground electrodes included in the plurality of electrodes; and a second-surface electrode provided at the second surface of the substrate and connected to the plurality of vias.