Optical Modulator Wire Bonding Resonance Control
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Solution Overview
Problem
In optical modulators with a large number of lead pins, the connection strength of wires bonded to these pins can fall below the critical connection strength due to resonance-induced vibration, leading to potential failures in optical communication systems, especially as the size of the housing is reduced and pin intervals become closer.
Innovation Solution
The optical modulator design features lead pins with varying loop shapes, directions, lengths, and heights of bonded wires, which differ from one another to reduce resonance and maintain connection strength by dispersing vibration energy, thereby preventing a decrease in wire bonding reliability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the housing size is reduced and pin intervals are made closer to achieve compact optical modulator design, then the device size is reduced, but the connection strength of wires bonded to lead pins decreases due to resonance-induced vibration
Solution Approach 1:
The patent applies asymmetry by varying the loop shapes of wires bonded to different lead pins. Instead of using uniform wire loop configurations, the invention introduces asymmetric variations in wire loop directions, lengths, and heights. This asymmetry disrupts the uniform vibration patterns that cause resonance, thereby preventing the propagation of vibrational energy through the housing and maintaining wire connection strength despite reduced housing size and closer pin intervals.
Solution Approach 2:
The patent applies local quality by making each wire loop configuration unique or differently grouped among the multiple lead pins. Rather than applying a single uniform design to all wire connections, the invention tailors the wire loop characteristics (shape, direction, length, height) locally for each lead pin or group of pins. This localized differentiation ensures that vibration from wire bonding at one location does not resonate uniformly across all connections, preserving connection reliability in compact designs.
2Ease of manufacture
If uniform wire loop shapes are used for all lead pins to simplify manufacturing, then the manufacturing process is simplified, but resonance occurs during wire bonding causing connection strength to fall below critical levels
Solution Approach 1:
The patent applies local quality by making each wire loop configuration unique or differently grouped among the multiple lead pins. Rather than applying a single uniform design to all wire connections, the invention tailors the wire loop characteristics (shape, direction, length, height) locally for each lead pin or group of pins. This localized differentiation ensures that vibration from wire bonding at one location does not resonate uniformly across all connections, preserving connection reliability in compact designs.
Solution Approach 2:
The patent applies parameter changes by varying multiple parameters of the wire loop configurations simultaneously - including loop shape, direction, length, and height. These parameter variations are introduced to different lead pins or groups of pins to create差异化 vibration characteristics. By changing these physical parameters, the invention disrupts resonance patterns while maintaining manufacturability through controlled variations rather than completely complex different designs.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach effectively suppresses the decrease in connection strength of wires bonded to lead pins, enhancing the reliability of wire bonding and reducing the risk of failures in optical communication systems by altering the vibration modes of lead pins during wire bonding.
Implementation Method 1
application of ultrasonic vibration is performed in addition to thermal compression bonding of a wire
Implementation Method 2
the frequency of the ultrasonic wave which is applied is different according to a type of an apparatus or a manufacturer of the apparatus. However, the frequency is in a range of about 30 kHz to 200 kHz
Data Source
AI summary
An optical modulation element configured by forming an optical waveguide on an optical element substrate and a polarization-combining part that combines light waves modulated in the optical modulation element are disposed in a housing. A plurality of lead pins are fixed to a side wall of the housing. Each of the plurality of lead pins has a protrusion portion protruding into an internal space of the housing and is electrically connected to the optical modulation element by bonding a wire to the protrusion portion. A loop shape of a wire that is bonded and connected to at least part of the lead pins among the plurality of lead pins is different from a loop shape of a wire that is bonded and connected to other lead pins.