Subminiature Optical Module Packaging for Automated 3D Alignment
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Solution Overview
Problem
The assembly of optical transmission modules, particularly the alignment of edge-type light emitting elements and arrayed waveguide gratings, is challenging due to sub-micron alignment requirements in x, y, and z directions, leading to increased assembly costs and complexity.
Innovation Solution
A subminiature optical transmission module is developed using a Fan Out Wafer Level Packaging (FOWLP) scheme, which automates optical alignment in all directions by embedding edge-type light emitting elements and an arrayed waveguide grating within a mold body, ensuring precise alignment and minimizing assembly complexity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conventional assembly methods are used for aligning edge-type light emitting elements and arrayed waveguide gratings, then sub-micron alignment precision can be achieved, but assembly complexity and cost increase significantly
Solution Approach 1:
The patent merges the light emitting element and the arrayed waveguide grating into a single integrated optical component. The waveguide grating is directly formed on the light emitting element substrate, eliminating the need for separate alignment and assembly processes. This integration maintains sub-micron alignment precision while dramatically reducing assembly complexity by treating previously separate components as a unified structure.
Solution Approach 2:
The patent applies preliminary action by pre-forming the waveguide grating pattern on the light emitting element substrate before final assembly. The grating structure is created in advance during the semiconductor fabrication process, ensuring precise spatial relationship between the light emitting element and the grating zones. This preliminary structuring eliminates the need for complex post-assembly alignment procedures.
2Ease of manufacture
If conventional packaging schemes are used, then electrical connections can be established, but the module size remains large and assembly difficulty increases
Solution Approach 1:
The patent combines multiple functions into a single integrated structure. The light emitting element, waveguide grating, and electrical connection terminals are all formed on the same substrate in an integrated arrangement. This merging of functions into a compact unified structure reduces the overall module volume while simplifying the manufacturing process by eliminating multiple separate assembly steps.
Solution Approach 2:
The patent transitions from a three-dimensional assembly of separate components to a planar two-dimensional integration on the substrate. The waveguide grating and light emitting element are arranged in the same plane, with optical paths defined by the grating zones rather than by physical separation in the z-direction. This dimensional change enables miniaturization while maintaining functional performance.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The automated optical alignment in the x, y, and z directions significantly reduces assembly difficulties and costs, while the miniaturized and integrated design enhances the module's performance and compatibility with high-speed optical communication systems.
Implementation Method 1
edge-type light emitting elements which are molded inside the mold body by fitting same to the first surface of the mold body so as to match with the first surface and generates an optical signal in the edge direction of a chip
Implementation Method 2
an arrayed waveguide grating (AWG) which is molded in the first surface of the mold body and includes, on one side thereof, a plurality of input waveguides corresponding to the plurality of edge-type light emitting elements, and optically multiplexes a plurality of optical signals incident through the plurality of input waveguides
Data Source
Figure 1A~1B
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AI summary
Provided are a subminiature optical transmission module and a method for manufacturing same, wherein optical alignment in x, y, and z directions between an edge-type light emitting element, an optical component, and an optical fiber can be automated, thereby solving the problem of assembly difficulty. The optical transmission module includes: a mold body having a first surface and a second surface opposite to each other; multiple edge-type light emitting elements, each of which is molded inside the mold body by fitting same to the first surface so as to match with the first surface and generates an optical signal in the edge direction of a chip; and an optical component disposed on one side thereof so as to optically multiplex multiple optical signals incident from the multiple edge-type light emitting elements and to output same, wherein the identical height is configured between the surface of each light emitting element and the optical axis of the optical component, and the edge direction of the chip is parallel to the first surface of the mold body.