Optical Module Carrier With Adhesive Layers for Fiber Alignment
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Solution Overview
Problem
Optical devices with integrated optical fibers face deformation and misalignment during reflow processes, leading to faulty connections and challenges in suction conveyance due to the obstruction caused by the fibers, which complicates mounting and limits the use of reflow ovens for high-profile components.
Innovation Solution
An optical module with a carrier having adhesive layers on both surfaces to securely bond optical devices and fibers, allowing for suction conveyance and reflow processing by using a mounter, while preventing fiber movement and ensuring precise positioning.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If optical fibers are connected to optical devices, then optical signal transmission is enabled, but the optical device deforms and fibers move during reflow process causing misalignment
Solution Approach 1:
The patent divides the optical module into distinct functional units: optical devices, optical fibers, optical receptacles, and a carrier. This segmentation allows each component to be independently positioned and fixed, preventing deformation and misalignment during reflow while maintaining optical signal transmission capability.
Solution Approach 2:
The patent introduces optical receptacles as intermediary components that connect optical fibers to optical devices. These receptacles are fixed to the carrier and provide stable mounting points, acting as mediators that prevent direct thermal stress transmission between fibers and devices during reflow, thereby maintaining alignment precision.
2Reliability
If optical fibers are present on the optical module, then optical coupling is achieved, but suction conveyance becomes difficult due to fiber obstruction
Solution Approach 1:
The patent extracts the optical fibers from the suction conveyance area by routing them through optical receptacles that are fixed to the carrier. The suction holes are positioned on the carrier surface away from fiber locations, effectively removing the obstruction problem while preserving optical coupling functionality.
3Reliability
If optical receptacles are fixed onto the module, then optical fiber connection is secured, but the module height increases limiting reflow oven selection
Solution Approach 1:
The patent utilizes the carrier as a separate dimensional platform that extends beyond the main module body. Optical receptacles are mounted on this carrier extension, allowing them to protrude horizontally rather than vertically. This dimensional reorganization maintains stable fiber connections while minimizing impact on module height profile.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables reliable suction conveyance and reflow processing of optical modules with optical fibers, preventing misalignment and facilitating the use of standard reflow ovens, even for high-profile components, thus ensuring accurate and efficient mounting.
Implementation Method 1
a carrier including a carrier substrate and adhesive layers formed on upper and lower surfaces of the carrier substrate. Both or either of the optical fibers and the optical device is bonded on a surface of the adhesive layer
Data Source
AI summary
An object is to easily convey by suction an optical module equipped with optical fibers having ends coupled to optical receptacles and mount the optical module on a substrate. An optical module according to the present invention includes an optical device to which optical fibers having ends coupled to optical receptacles are optically coupled and also includes a carrier composed of a substrate and adhesive layers formed on the upper and lower surfaces of the substrate. The optical device is bonded on the adhesive layer formed on the lower surface of the substrate. Part of the optical fibers and the optical receptacles are bonded on the adhesive layer formed on the surface of the substrate.