Optical Module Adhesive Layout for Alignment and Heat Dissipation
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Solution Overview
Problem
Existing methods face challenges in fixing optical semiconductor elements with adjusted optical axes using thermosetting materials with high heat dissipation performance while maintaining their position, as curing thermosetting materials requires high temperatures and UV curable materials lack sufficient heat dissipation.
Innovation Solution
A dual adhesive system is employed, where a UV curable material is used initially for fixing the optical semiconductor element, followed by a thermosetting material with higher heat conductivity, allowing for UV curing without disrupting the optical axis, and subsequent thermal curing while maintaining the adjusted position.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If a thermosetting material with high thermal conductivity is used to fix the optical semiconductor element, then heat dissipation performance is improved, but the curing process requires high temperatures which may cause position deviation of the optical semiconductor element
Solution Approach 1:
The adhesive system is segmented into two distinct components: a UV curable adhesive for initial positioning and a thermosetting adhesive for final thermal bonding. This segmentation allows the curing processes to be separated in time, enabling the optical semiconductor element to be positioned and fixed with UV light before thermal curing occurs, thus preventing position deviation while achieving high heat dissipation.
Solution Approach 2:
The UV curable adhesive is applied first to perform the preliminary action of positioning and fixing the optical semiconductor element in its correct orientation. This preliminary fixation occurs before the thermal curing process, ensuring that when the thermosetting adhesive is subsequently cured at high temperature, the element remains securely in place without position deviation.
2Ease of manufacture
If a UV curable material is used to fix the optical semiconductor element, then positioning and curing process is simplified, but heat dissipation performance is insufficient
Solution Approach 1:
The adhesive system uses a composite material approach by combining a UV curable adhesive (for ease of positioning and curing) with a thermosetting adhesive containing high thermal conductivity fillers (for heat dissipation). The UV curable component enables simple and quick positioning, while the thermosetting component provides the necessary thermal management, achieving both ease of manufacture and effective heat dissipation.
3Strength
If high temperature thermal curing is applied to the adhesive, then bond strength and heat dissipation are improved, but the optical axis alignment of the semiconductor element may deviate
Solution Approach 1:
The UV curable adhesive performs the preliminary action of securing the optical semiconductor element in its precisely aligned position before thermal curing. This preliminary fixation creates a rigid structure that maintains optical axis alignment during the subsequent high-temperature thermal curing process, ensuring both bond strength and alignment precision are achieved.
Solution Approach 2:
The UV cured adhesive layer acts as a protective cushioning layer that prevents position deviation during thermal curing. By establishing this stable base layer beforehand, the system cushions against the thermal expansion and potential shifting that could occur during high-temperature curing, thereby preserving optical axis alignment while achieving strong bonding.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables effective heat dissipation and stable fixation of the optical semiconductor element, preventing axis deviation during thermal curing, enhancing thermal conductivity and maintaining optical alignment.
Implementation Method 1
The first adhesive mainly includes a UV curable material
Implementation Method 2
The second adhesive mainly includes a thermosetting material and has a second thermal conductivity higher than the first thermal conductivity
Data Source
AI summary
An optical module includes a base material, an optical semiconductor element, an optical circuit element, a first adhesive, and a second adhesive. The base material has a first surface. The optical semiconductor element has a first optical port and is provided on the first surface. The optical circuit element has a second optical port, which faces the first optical port and is optically coupled to the first optical port, in a side surface thereof. The optical circuit element is disposed alongside the optical semiconductor element on the first surface. The first adhesive mainly includes a UV curable material. The first adhesive fixes the optical semiconductor element to the first surface and has a first thermal conductivity. The second adhesive mainly includes a thermosetting material and has a second thermal conductivity higher than the first thermal conductivity. The second adhesive fixes the optical semiconductor element to the first surface.