Optical module and thermoelectric module
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Solution Overview
Problem
There is a need for miniaturization of optical modules, particularly in transmitter and receiver optical sub-assemblies, where reducing the height is essential, but existing configurations without a base pose challenges in soldering, wiring, and alignment of optical elements.
Innovation Solution
The optical module design includes a thermoelectric module with a first and second substrate, where thermoelectric elements are placed between them, and patterns made of different materials are formed on the substrate surface to facilitate mounting and alignment of optical elements without a base, enabling reduced height and improved soldering and wiring.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of stationary object
If a base is removed to reduce height, then the height of the optical module is reduced, but the ease of soldering, wiring, and alignment of optical elements deteriorates
Solution Approach 1:
The base and the first substrate are merged into a single integrated structure. The first substrate serves dual functions as both the mounting base for optical elements and the substrate for thermoelectric elements, eliminating the need for a separate base component while maintaining all necessary functions for soldering, wiring, and alignment.
Solution Approach 2:
The first substrate is designed to perform multiple functions simultaneously: it serves as the mounting base for optical elements, provides wiring connections through conductive patterns, enables alignment through marker patterns, and acts as the substrate for thermoelectric elements. This multi-functionality replaces what would traditionally require separate base, wiring layer, and alignment marker components.
2Length of stationary object
If optical elements are mounted directly on the first substrate without a base, then the height is reduced, but the manufacturing precision for mounting and alignment deteriorates
Solution Approach 1:
Marker patterns are formed at specific locations on the first substrate to provide localized alignment references. These patterns are strategically positioned to enable precise alignment of optical elements during mounting, ensuring high manufacturing precision only where needed rather than requiring the entire substrate to have uniform precision features.
Solution Approach 2:
The marker patterns are pre-formed on the first substrate before optical elements are mounted. This preliminary preparation of alignment references allows for accurate positioning and alignment to be performed during the mounting process, ensuring high manufacturing precision without requiring complex real-time adjustment mechanisms.
3Device complexity
If the number of components is reduced by removing the base, then the device complexity is reduced, but the reliability of soldering and wiring connections deteriorates
Solution Approach 1:
The base and first substrate are merged into one component, eliminating the interface between them and thereby eliminating potential failure points at that interface. All soldering and wiring connections are now made directly to the first substrate, which is designed with appropriate conductive patterns and mounting structures to ensure reliable connections.
4Ease of manufacture
If patterns are formed on the first substrate surface, then the ease of mounting and alignment is improved, but the manufacturing complexity of the substrate increases
Solution Approach 1:
Patterns are formed only at specific locations on the first substrate surface where they are needed for mounting and alignment, rather than covering the entire substrate. This localized patterning provides the necessary functionality while minimizing the added manufacturing complexity to only the areas where patterns are required.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration allows for a reduction in the overall height of the optical module while ensuring suitable mounting, soldering, and alignment of optical elements, addressing the challenges of miniaturization and efficiency.
Implementation Method 1
a plurality of thermoelectric elements provided between the first substrate and the second substrate
Data Source
AI summary
An optical module includes: an optical element; and a thermoelectric module on which the optical element is mounted. Further, the thermoelectric module includes a first substrate, a second substrate disposed to face the first substrate, and a plurality of thermoelectric elements provided between the first substrate and the second substrate, and a pattern made of a material different from a material of the first substrate is formed on a surface of the first substrate opposite to a back surface of the first substrate facing the second substrate, and the optical element is mounted on the surface of the first substrate in association with the pattern.