Optical Module BGA Fiber Routing Stability

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Solution Overview

Problem

Conventional optical modules with BGA packages face issues of bad connections during reflow mounting due to the weight of optical fibers causing the BGA package to incline, leading to poor electrical connections.

Innovation Solution

An optical module design incorporating a fiber routing mechanism with thermal conductivity, which allows the optical fiber to be wound around a recessed area, providing stability and reducing the likelihood of inclination during reflow mounting, and optionally incorporating a heat insulating material or integral structure for enhanced thermal management and protection.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If optical fiber is drawn from the optical fiber drawing part, then optical signal transmission is enabled, but the BGA package inclines under the weight of the optical fiber causing bad connection

Engineering Contradiction:
Improveconnection reliabilityVSAvoidoptical fiber weight
Core Design Contradiction:
ReliabilityVSWeight of moving object

Solution Approach 1:

The patent introduces a fiber routing mechanism as an intermediary structure between the optical fiber drawing part and the BGA package. This mechanism includes a fiber routing hole and routing structure that guides and supports the optical fiber, preventing it from directly weighing on the BGA package and causing inclination. The intermediary structure transfers the fiber's weight to the housing or mounting structure instead.

Inventive Principle:
Principle #24Intermediary (Mediator)

2Ease of manufacture

If BGA package is mounted on substrate by reflowing, then packaging cost is reduced, but the optical fiber weight causes BGA inclination during reflowing

Engineering Contradiction:
Improvepackaging costVSAvoidBGA package stability
Core Design Contradiction:
Ease of manufactureVSStability of the object's composition

Solution Approach 1:

The patent implements preliminary action by pre-configuring the fiber routing mechanism and fiber support structures before the reflow mounting process. The routing mechanism is integrated into the housing structure in advance, creating a stable pathway for the optical fiber that prevents inclination during subsequent reflowing operations. This preliminary structural preparation ensures the BGA package maintains stability throughout the manufacturing process.

Inventive Principle:
Principle #10Preliminary action

3Reliability

If fiber routing mechanism is added, then BGA inclination is prevented, but device complexity increases

Engineering Contradiction:
Improveconnection reliabilityVSAvoidfiber routing mechanism complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The patent applies merging by integrating the fiber routing mechanism with the existing housing structure and mounting components. The fiber routing hole and support structures are combined with the housing body and BGA mounting structure, creating a unified design rather than adding separate independent components. This integration reduces overall device complexity while maintaining the functionality of preventing BGA inclination.

Inventive Principle:
Principle #5Merging (Combining)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The design significantly reduces the rate of bad connections during reflow mounting by stabilizing the optical module's center of gravity and protecting the optical fiber from heat, ensuring reliable electrical and optical signal transmission.

Implementation Method 1

a lid having a thermal conductivity connected to another face of the substrate; a fiber routing mechanism having a thermal conductivity thermally connected to a face of the lid

Methodology Applied
Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 2

the fiber routing mechanism is provided with a part made of a heat insulating material

Methodology Applied
Scientific EffectThermal insulation: Thermal Insulation

Data Source

PatentUS11561350B2Optical module
Publication Date: 2023.01.24 NIPPON TELEGRAPH & TELEPHONE CORP
  • US11561350B2 patent drawing
  • US11561350B2 patent drawing
  • US11561350B2 patent drawing

AI summary

To reduce bad connections of a BGA optical module as an optical fiber interface during mounting by reflowing. An optical module includes: a substrate to which an optical fiber is connected and fixed and on which an electronic circuit, an optical circuit or the like is formed; a ball grid array provided on one face of the substrate as an electrical interface used when the optical module is mounted on a mounting substrate; a lid having a thermal conductivity provided on another face of the substrate; and a fiber routing mechanism provided in contact with the lid, the fiber routing mechanism having a thermal conductivity and shaped to enable the optical fiber to be wound around the fiber routing mechanism.