Optical Module with Bonded Silicon Plates for Light Efficiency
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing optical modules face challenges in efficiently integrating light reflective and transmissive optical components due to contradictory requirements for substrate characteristics, such as impurity concentration, which affects light use efficiency and component performance.
Innovation Solution
The optical module consists of separate plate-shaped members for light transmissive and reflective optical components, allowing for optimized substrate characteristics for each type, with the light transmissive component formed on a silicon region with minimal impurities and the reflective component on a substrate with appropriate impurity levels for conductivity, and bonding these members to minimize metal film adherence issues.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If a metal film is deposited on a surface perpendicular to the board surface of a substrate, then a light reflective optical component can be formed, but metallic particles spread and adhere to light transmissive optical components, requiring them to be disposed at separated regions
Solution Approach 1:
The invention divides the substrate into multiple regions with different impurity concentrations: a first region for light transmissive optical components with low impurity concentration and a second region for light reflective optical components with high impurity concentration. This segmentation allows each component type to be optimized independently, preventing metal particle contamination while maintaining high light use efficiency through closer component placement.
2Reliability
If a substrate with high dopant concentration is used to obtain conductive property for electrostatic actuator, then conductive component can be formed, but light absorption increases in light transmissive optical components
Solution Approach 1:
The invention applies local quality by creating spatially varying impurity concentrations within the substrate. The first region has low impurity concentration optimized for light transmission with minimal absorption, while the second region has high impurity concentration optimized for electrical conductivity in the electrostatic actuator. This local differentiation resolves the contradiction between conductive performance and light transmission efficiency.
3Device complexity
If various types of optical components are formed by use of one substrate, then device complexity is reduced, but it is difficult to satisfy contradictory requirements for substrate characteristics
Solution Approach 1:
The invention changes the physical parameter of impurity concentration within the substrate to resolve contradictory requirements. By creating a substrate with spatially varying impurity concentrations - low in the first region for light transmissive components and high in the second region for conductive components - the invention maintains device integration while satisfying different substrate characteristics for different component types.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enables closer placement of optical components, improving light use efficiency and satisfying contradictory substrate requirements, while allowing for separate processing of reflective and transmissive components to prevent metal adherence and optimize performance.
Implementation Method 1
in order to inhibit absorption of light, it is preferable that the impurities contained in a substrate are less
Implementation Method 2
a second plate-shaped member having a light reflective optical component for reflecting light transmitting through the light transmissive optical component
Implementation Method 3
the first and second plate-shaped members are bonded to one another
Data Source
AI summary
An optical module includes a first plate-shaped member having a light transmissive optical component which is formed by applying etching to a silicon region, and a second plate-shaped member having light reflective optical components (mirrors) for reflecting light transmitting through the light transmissive optical component. The first and second plate-shaped members are bonded to one another, and an optical path for light transmitting through the light transmissive optical component is along a component forming surface of the first plate-shaped member and a principal surface of the second plate-shaped member. Thereby, realizing an optical module in which it is possible to dispose the light reflective optical component and the light transmissive optical component close to one another, and a manufacturing method for the optical module.