Optical Module Direct Bonding for Head-Mounted Display Alignment
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Solution Overview
Problem
Head-mountable devices face challenges in maintaining optimal alignment of display components, such as light projection display elements and waveguides, which are sensitive to deformation, leading to undesirably heavy and large components that compromise the device's lightweight and compact design.
Innovation Solution
A direct coupling of the light projection display element to an assembly including a waveguide, achieved by bonding it to a lens or optical component, allows for precision alignment during assembly outside the device and subsequent integration, maintaining component alignment while enabling a lightweight and compact form factor.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If robust structural support is provided for waveguide and display element, then alignment is maintained, but device becomes heavy and large
Solution Approach 1:
The patent merges the waveguide and display element into a single integrated optical module assembly. The display element is directly coupled to the waveguide, eliminating the need for separate robust structural supports for each component. This integration maintains alignment while reducing overall device weight and size.
Solution Approach 2:
The patent introduces a specialized coupling structure that acts as an intermediary between the display element and waveguide. This coupling structure is designed to maintain precise alignment while being lightweight, replacing the need for heavy robust structural support.
2Manufacturing precision
If robust structural support is provided for waveguide and display element, then alignment is maintained, but device size increases
Solution Approach 1:
The patent merges the waveguide and display element into a single integrated optical module assembly. This consolidation maintains alignment through direct coupling while significantly reducing the overall volume occupied by these components, enabling a compact device form factor.
Solution Approach 2:
The patent employs a nested arrangement where the display element is positioned within or directly coupled to the waveguide structure. This nesting approach maintains precise alignment while minimizing the external dimensions of the optical module.
3Weight of moving object
If component alignment is maintained through direct coupling, then device remains lightweight, but alignment sensitivity to deformation increases
Solution Approach 1:
The patent incorporates deformation compensation features in the coupling structure between the display element and waveguide. These features are designed beforehand to absorb and compensate for thermal expansion and mechanical deformations, maintaining alignment stability while keeping the device lightweight.
Solution Approach 2:
The patent utilizes materials with matched thermal expansion coefficients for the display element, waveguide, and coupling structure. This parameter matching reduces differential expansion and deformation, maintaining alignment stability without requiring heavy structural support.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach ensures the head-mountable device remains lightweight and small in size while maintaining the necessary alignment for optimal performance of display components, addressing the issue of component deformation and alignment sensitivity.
Implementation Method 1
bonding it to a lens or optical component
Data Source
AI summary
Head-mountable devices can include a light projection display element that is directly coupled to an assembly that includes a waveguide. Such a direct coupling can be achieved by bonding the light projection display element directly to a lens or other optical component that is, in turn, directly coupled to the waveguide. Such an optical module can be assembled outside of the head-mountable device for precision alignment and subsequently installed as an integrated unit. These measures can help maintain component alignment while allowing a head-mountable device to be lightweight and small in size.