Optical Module Bonding Wire Height Optimization

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Solution Overview

Problem

In optical communication systems, the interconnection between silicon optical chips and circuit boards using wire bonding faces challenges due to the complexity and inefficiency of bonding wire arrangements, which affects signal transmission and grounding, leading to potential crosstalk and reduced bandwidth.

Innovation Solution

The optical module design incorporates a circuit board and a silicon optical chip with strategically arranged bonding pads and wires, where signal transmission and grounding pads are connected through multiple bonding wires, with alternating arrangements and varying wire heights to minimize crosstalk and enhance bandwidth by optimizing the equivalent resistance and inductance of the bonding wires.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If concentrated bonding wires are used to connect silicon optical chip to circuit board, then electrical connection is achieved, but crosstalk and reduced bandwidth occur

Engineering Contradiction:

Improveelectrical connectionVSAvoidcrosstalk

Core Design Contradiction:

ReliabilityVSObject-affected harmful factors

Solution Approach 1:

The bonding wires are divided into multiple independent groups, with each group connecting specific bonding pads. Signal transmission wires and grounding wires are segmented into separate groups, preventing signal interference while maintaining electrical connection reliability

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

Grounding bonding wires act as intermediaries between signal transmission wires and the circuit board ground. These grounding wires are strategically positioned to shield signal wires from crosstalk and provide a reference potential, mediating the electromagnetic environment between chip and board

Inventive Principle:

Principle #24Intermediary (Mediator)

2Reliability

If multiple bonding wires are used for signal transmission, then electrical connection is improved, but device complexity increases

Engineering Contradiction:

Improvesignal transmissionVSAvoidbonding wire arrangement

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

Different regions of the bonding wire arrangement have different functions: signal transmission regions use insulated wires for data carry, while grounding regions use exposed wire sections for potential contact and shielding. This local differentiation optimizes performance while managing complexity through functional zoning

Inventive Principle:

Principle #3Local quality

Solution Approach 2:

The bonding wire arrangement extends into the spatial dimension with wires positioned at different heights and angles. Some wires are arranged to potentially contact the circuit board surface, creating a three-dimensional bonding structure that improves signal integrity without planar complexity

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

3Object-affected harmful factors

If bonding wires are arranged with varying heights and angles, then crosstalk is reduced, but manufacturing precision requirements increase

Engineering Contradiction:

Improvecrosstalk reductionVSAvoidbonding wire positioning

Core Design Contradiction:

Object-affected harmful factorsVSManufacturing precision

Solution Approach 1:

The bonding wire arrangement employs asymmetric configurations where wires have different heights, angles, and positions relative to the chip and circuit board. This asymmetry is deliberately designed to maximize spacing between signal wires and minimize crosstalk, with grounding wires positioned to provide optimal shielding rather than uniform symmetry

Inventive Principle:

Principle #4Asymmetry

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This design improves the signal transmission rate and reduces crosstalk by increasing the bandwidth and ensuring efficient electrical connections between the silicon optical chip and the circuit board, facilitating high-speed data processing and reliable grounding.

Implementation Method 1

a chip bonding pad is electrically connected to at least one corresponding circuit board bonding pad through a plurality of bonding wires

Methodology Applied

Scientific EffectElectrical conduction: Conduction (electrical)

Implementation Method 2

The plurality of bonding wires have different heights, with an angle formed between bonding wires with different heights

Methodology Applied

Scientific EffectElectromagnetic interference reduction:

Data Source

PatentUS20240402428A1Optical Module

Publication Date: 2024.12.05 HISENSE BROADBAND MULTIMEDIA TECH

AI summary

An optical module includes a circuit board and a silicon optical chip. The circuit board includes a plurality of circuit board bonding pads. The silicon optical chip includes a plurality of chip bonding pads corresponding to the plurality of circuit board bonding pads. The plurality of chip bonding pads are electrically connected to the corresponding circuit board bonding pads, so that the silicon optical chip is electrically connected to the circuit board. A chip bonding pad is electrically connected to at least one corresponding circuit board bonding pad through a plurality of bonding wires, or a circuit board bonding pad is electrically connected to at least one corresponding chip bonding pad through a plurality of bonding wires. The plurality of bonding wires have different heights, with an angle formed between bonding wires with different heights.