Optical Module Boss Thermal Conduction
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The existing optical modules suffer from low heat dissipation efficiency, leading to rapid aging and inactivation of internal circuits, especially when operated in high-temperature environments, due to inadequate thermal conduction methods.
Innovation Solution
The optical module design incorporates bosses on the optical sub-modules that embed into corresponding openings in the housing, creating a larger contact area for heat absorption and transfer, enhancing heat dissipation efficiency by allowing quick heat absorption and transfer to the external cage through the housing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If thermal adhesive is used to transfer heat from TOSA to housing, then heat dissipation is achieved, but thermal conduction efficiency is low
Solution Approach 1:
The patent introduces a metal boss as an intermediary thermal conduction component between the TOSA and the housing. The boss with through-hole structure serves as a mediator that significantly improves thermal conduction efficiency compared to direct thermal adhesive bonding, while maintaining reliable mechanical and thermal connection.
Solution Approach 2:
The patent employs a composite thermal management structure combining metal boss (high thermal conductivity material) with thermal adhesive. This composite approach leverages the superior thermal conduction properties of metal while utilizing the adhesive's bonding capabilities, achieving both efficient heat transfer and reliable structural connection.
2Temperature
If optical module operates in high-temperature environment for long time, then heat dissipation is necessary, but untimely heat dissipation causes rapid aging and inactivation
Solution Approach 1:
The metal boss acts as an intermediary heat transfer component that enables timely heat dissipation from the TOSA to the housing. This intermediate structure provides dedicated thermal pathways that prevent heat accumulation, thereby extending the optical module's service life under high-temperature operating conditions.
3Loss of energy
If boss is embedded into housing opening, then contact area increases for better heat transfer, but structural complexity increases
Solution Approach 1:
The metal boss serves multiple functions simultaneously: it provides thermal conduction pathway, acts as mechanical support structure, and creates EMI shielding effect through the through-hole design. This multi-functionality reduces the need for separate components, thereby managing structural complexity while achieving superior thermal performance.
Solution Approach 2:
The patent applies local quality enhancement by concentrating thermal conduction capability at the boss-housing interface through the embedded structure. The through-hole design locally optimizes thermal pathways while maintaining overall structural simplicity, achieving high thermal efficiency without proportionally increasing overall device complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design significantly improves heat conduction efficiency, preventing inactivation of the optical module even under severe operating conditions, while maintaining a compact structure and preventing electromagnetic wave leakage.
Implementation Method 1
the heat generated by the TOSA is transmitted to a housing of the optical module via the thermal adhesive... the boss will absorb the heat and transfer the heat to the housing quickly
Data Source
Figure 1
Figure 2
Figure 3~4
AI summary
The present disclosure provides an optical module, including: an optical sub-module (1) and a first housing (2); where a first sub-surface of the optical sub-module is provided with a first boss (11), and the first housing is provided with a first opening (21) corresponding to the first boss. The improved structure of the optical module can greatly increase heat conduction efficiency of the optical module.