Optical Module Layout Without BOX Packaging for Miniaturization
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Solution Overview
Problem
Current optical modules face challenges in miniaturization and high-density integration due to complex packaging structures, which hinder the efficient interconversion of optical and electrical signals, especially with increasing transmission rates and diverse application scenarios.
Innovation Solution
The optical module design incorporates a first support member and a second support member to directly place light emission and reception components on the circuit board, eliminating the need for BOX packaging and reducing packaging parts, while using optical fiber adapters for signal transmission, thereby simplifying the structure and enhancing integration.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If traditional BOX packaging structure is used for optical modules, then component protection and signal transmission are ensured, but device complexity and packaging space increase, hindering miniaturization
Solution Approach 1:
The patent extracts and eliminates the traditional BOX packaging structure from the optical module design. By removing this complex packaging layer, the module achieves direct mounting of optical components on the circuit board, significantly reducing packaging space and device complexity while maintaining functional integrity
Solution Approach 2:
The patent merges the support function previously provided by the BOX structure directly into the circuit board through the first support member. This consolidation eliminates separate packaging components and integrates structural support with the electrical circuit substrate, reducing overall device complexity
2Quantity of substance
If multiple packaging parts are used to support optical components, then component stability is ensured, but invalid space increases and integration density decreases
Solution Approach 1:
The patent removes unnecessary packaging parts from the optical module design. By extracting only the essential support function and implementing it through the first support member integrated with the circuit board, the design eliminates redundant components that occupied invalid space and hindered integration density
Solution Approach 2:
The first support member serves multiple functions simultaneously: it provides mechanical support for optical components, maintains structural stability, and integrates with the circuit board's electrical pathways. This multi-functionality reduces the need for separate packaging parts while maintaining component stability
3Reliability
If complex packaging structures are implemented, then component protection is improved, but manufacturing complexity and assembly difficulty increase
Solution Approach 1:
The patent extracts the protective function from the complex BOX packaging structure and implements it through simplified means: the first support member provides mechanical protection while the circuit board itself serves as the mounting structure. This reduction in packaging complexity directly improves ease of manufacture and assembly
Solution Approach 2:
The patent combines the protective support function with the circuit board structure through the first support member. This merging eliminates the need for separate complex packaging assemblies, reducing manufacturing steps and assembly difficulty while maintaining adequate component protection
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design facilitates miniaturization and high-density integration of the optical module, improving signal transmission efficiency and reducing invalid space, while maintaining effective interconversion of optical and electrical signals.
Implementation Method 1
The laser component is configured to generate emission light
Implementation Method 2
The reflector is arranged on the cover plate and is configured to reflect a reception light to the detector component
Implementation Method 3
The detector component is configured to convert the reception light into an electrical signal
Data Source
AI summary
An optical module includes a circuit board, a first support member, a laser component and a detector component. The first support member supports the circuit board, a through hole is provided in the first support member below the circuit board; the laser component is provided on front surface of the first support member and electrically connected to welding pin on front surface of the circuit board through wire bonding; the detector component is provided on back surface of the circuit board, located in the through hole, and is electrically connected to signal wiring on back surface of the circuit board; the detector component is configured to convert reception light into electrical signal. With the first support member, light emission and reception components may be directly arranged on a carrier formed by the first support member and the circuit board, facilitating miniaturization of the optical module.