Miniaturized Optical Module With Carrier Substrate
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Solution Overview
Problem
Existing optical modules are limited in their ability to meet diverse application requirements for optical, electrical, thermal, and mechanical connections, and are often restricted to specific mounting schemes that may damage optical elements during assembly.
Innovation Solution
An optical module design featuring a carrier substrate with electrical connection terminals on both surfaces, allowing the optically transparent carrier to be mechanically and electrically connected through the substrate, enabling flexible mounting options such as soldering or clamping, and incorporating a heat dissipating element for thermal management.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If the optically transparent carrier is directly mounted on the circuit carrier by soldering or adhesive attach, then mechanical connection is achieved, but the optical elements may be damaged during assembly and the mounting scheme is limited
Solution Approach 1:
The patent introduces a carrier substrate as an intermediate component between the optically transparent carrier and the circuit carrier. This segmentation separates the mechanical mounting function (performed by the carrier substrate on the circuit carrier) from the optical element mounting function (performed by the optically transparent carrier), thereby protecting optical elements from damage during soldering or adhesive attachment processes while enabling robust mechanical connection.
2Volume of moving object
If the optically transparent carrier is directly mounted on the circuit carrier, then a compact design is achieved, but the module can only be used in applications with specific thermal and mechanical connection requirements
Solution Approach 1:
The carrier substrate is designed with multiple functions: it provides mechanical support for mounting the optically transparent carrier, enables thermal management through heat dissipation structures, facilitates electrical connections via connection terminals, and allows various mounting schemes (soldering, adhesive attach, clamping). This multi-functionality makes the optical module adaptable to diverse application requirements while maintaining a compact form factor.
3Device complexity
If the optically transparent carrier is directly mounted on the circuit carrier, then assembly is simplified, but thermal management becomes limited as the casing must act as heat sink
Solution Approach 1:
The carrier substrate acts as an intermediary component between the optically transparent carrier and the circuit carrier, specifically serving as a thermal management interface. It incorporates heat dissipation structures such as thermal bridges and heat sinks that actively manage heat flow from optical elements and integrated circuits, thereby improving thermal performance without complicating the assembly process.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The optical module achieves robust, reliable connections and adaptable functionality across various applications, reducing the risk of damaging optical elements during assembly and enhancing thermal performance.
Implementation Method 1
an optical element (120) electrically connected to the optically transparent carrier (110), wherein the optically transparent carrier (110) is mechanically attached and electrically connected to the carrier substrate (140)
Implementation Method 2
there is an opening in the circuit carrier through which the heat is dissipated by means of a thermal bridge (not shown) in order to transfer the heat generated by integrated circuits and optical elements
Implementation Method 3
the transparent carrier 2110 is generally fixed on the circuit carrier 2200 by means of solder bumps or adhesive attach
Implementation Method 4
the transparent carrier 2110 is generally fixed on the circuit carrier 2200 by means of solder bumps or adhesive attach
Data Source
AI summary
The present disclosure relates to an optical module comprising a carrier substrate including first electrical connection terminals on a first surface and second electrical connection terminals on a second surface electrically connected to the first electrical connection terminals. The second electrical connection terminals are connectable to a circuit carrier. The optical module further comprises an optically transparent carrier including first electrical connection terminals, and an optical element electrically connected to the optically transparent carrier. The optically transparent carrier is mechanically attached and electrically connected to the carrier substrate trough corresponding first electrical connection terminals, and the optical element is connected on a first surface of the optically transparent carrier and is adapted to emit/receive light through the optically transparent carrier to/from an optical coupling element facing a second surface of the optically transparent carrier opposing the first surface.