Optical Module Carrier Substrate Ground Wiring Layout
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Solution Overview
Problem
Existing optical modules face challenges in reducing size while maintaining reliability, particularly due to the narrow gaps between components which make it difficult to route wires and can lead to stress on the carrier substrate, potentially causing reliability degradation.
Innovation Solution
The optical module design includes a carrier substrate with signal and ground wiring patterns that are fixed to one surface of the housing, eliminating the need for wires to pass through narrow gaps and reducing stress by ensuring the carrier substrate is only attached at one surface, thereby minimizing size and enhancing reliability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If wires are routed through narrow gaps between components, then electrical connection is achieved, but stress on the carrier substrate increases and reliability degrades
Solution Approach 1:
The patent extracts the wiring function from the narrow gaps between components and relocates it to the surface of the carrier substrate through pad structures. This eliminates the need for wires to pass through stress-prone narrow gaps, thereby reducing stress on the carrier substrate while maintaining electrical connectivity.
Solution Approach 2:
The patent transitions the wiring approach from a three-dimensional path through narrow gaps to a two-dimensional surface layout using pad structures. By spreading out the electrical connections on the carrier substrate surface, the design avoids the stress concentration issues associated with tight spatial constraints in the vertical dimension.
2Volume of moving object
If the optical module size is reduced, then integration density increases, but it becomes difficult to route wires and maintain reliability
Solution Approach 1:
The patent resolves the conflict between miniaturization and reliability by changing the wiring dimension from vertical (through gaps) to horizontal (on surface). This allows compact module design while maintaining reliable electrical connections through the pad structure layout on the carrier substrate surface.
Solution Approach 2:
The pad structures serve as intermediary elements that facilitate electrical connections without requiring physical wires through narrow gaps. These pads act as intermediate connection points between components and the carrier substrate, enabling reliable connectivity in a compact form factor.
3Reliability
If ground terminals are not properly connected to common ground pad, then device complexity reduces, but ground terminal potential becomes unstable
Solution Approach 1:
The patent merges multiple ground terminals into a single common ground pad structure on the carrier substrate. This consolidation provides a stable reference potential for all ground terminals while simplifying the overall grounding architecture, as the common pad serves as a unified connection point for multiple components.
Data Source
AI summary
An optical module includes: photoelectric elements including first terminal groups; an integrated circuit including second terminal groups and ground terminals; a carrier substrate; a housing; and a common ground pad. Further, the carrier substrate is fixed to one surface of the housing, the carrier substrate includes signal wiring parts and a ground wiring part, the ground wiring part includes terminal pattern parts, a common pattern part, and a coupling part, each of the terminal pattern parts being disposed between the corresponding signal wiring parts and electrically connected with one of the ground terminals, the common pattern part being disposed on a side where the common ground pad is provided on the carrier substrate, the coupling part electrically connecting each terminal pattern part and the common pattern part, and the ground terminals of the integrated circuit are electrically connected with the common ground pad through the ground wiring part.