Optical Module Cavity Structure for PIC Stress Isolation
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Solution Overview
Problem
Photonic integrated circuits (PICs) face issues with reliability and size constraints due to the use of molding compounds, which can damage optical devices and complicate optical routing paths, hindering high-speed data communication.
Innovation Solution
An optical module design featuring a carrier and lid that define a cavity for photonic components, with a first aperture for light transmission/reception and an interconnection structure providing electrical connections, allowing for separate exposure of photonic components to reduce stress and enable compact size.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a molding compound is used to encapsulate the photonic integrated circuit, then the optical devices are protected, but the applied force and stress may damage the optical devices
Solution Approach 1:
The encapsulation structure is segmented into multiple functional zones: a first cavity for optical devices, a second cavity for electronic devices, and a third cavity for electrical connections. This segmentation allows each zone to be optimized independently, reducing stress transmission to optical devices while maintaining protection.
Solution Approach 2:
The lid serves as an intermediary structure between the external environment and the photonic integrated circuit. It provides mechanical support and protection while isolating stress sources from the optical devices through its structural design and material selection.
2Reliability
If a molding compound is used to encapsulate the photonic integrated circuit, then the optical devices are protected, but the size of the PIC cannot be reduced
Solution Approach 1:
The patent transitions from planar integration to three-dimensional stacked integration. Multiple functional layers (optical devices, electronic devices, electrical connections) are arranged vertically in separate cavities, enabling compact size reduction while maintaining protection and functionality.
Solution Approach 2:
The structure employs nested cavities where the first cavity containing optical devices, the second cavity containing electronic devices, and the third cavity containing electrical connections are arranged in a nested or stacked configuration, maximizing space utilization and reducing overall module size.
3Volume of moving object
If optical devices are densely packed to reduce size, then the module size is reduced, but optical routing paths become complicated and optical performance is impacted
Solution Approach 1:
Optical routing is simplified by segmenting functional zones into separate cavities. The first cavity dedicated to optical devices allows for straightforward optical path design without the complexity of dense intermingling, while the lid provides structured routing channels.
Solution Approach 2:
The patent resolves routing complexity by transitioning from two-dimensional planar routing to three-dimensional vertical stacking. Optical signals can be routed vertically through the lid structure between cavities, simplifying path design compared to lateral routing in densely packed configurations.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design enhances reliability by avoiding damage to optical devices and reduces size, improving optical performance and signal routing efficiency.
Implementation Method 1
The photonic component is configured to change a first propagation direction of a first light to a second propagation direction toward the first aperture
Data Source
AI summary
An optical module is disclosed. The optical module includes a carrier and a lid disposed over the carrier. The carrier and the lid are collaboratively define a first cavity for accommodating a photonic component. The optical module also includes a first electrical contact disposed over a first side of the lid and configured to provide an electronic connection for the optical module. A first aperture penetrating the lid is formed at the first side of the lid and corresponds to a light transmission/reception area of the photonic component.