Optical Module Heat Dissipation Structure for Close-Coupled Cooling

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Solution Overview

Problem

Conventional optical modules face issues with heat dissipation efficiency, particularly in high transmission rate and compact configurations, where heat dissipation components are often too far from the heat source, leading to inefficient heat transfer, and liquid-based heat dissipation can contaminate the module interior.

Innovation Solution

The optical module incorporates a heat dissipation component with a heat dissipation body and thermally conductive medium, featuring a protective cover and flange to prevent liquid contamination, and a flip chip structure to enhance heat transfer without contacting the substrate's copper pour, improving thermal management.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If conventional heat dissipation components are used in optical modules, then heat dissipation function is provided, but heat dissipation efficiency is poor because the components are too far from the heat source

Engineering Contradiction:

Improveheat dissipation efficiencyVSAvoiddistance between heat dissipation component and heat source

Core Design Contradiction:

TemperatureVSLength of moving object

Solution Approach 1:

The patent merges the heat dissipation body directly with the electronic component by making the heat dissipation body an extension of the electronic component's housing, eliminating the need for separate heat dissipation components and reducing the distance between heat source and heat dissipation structure to zero.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The patent extends the heat dissipation body outward from the electronic component in a directional manner, creating a heat dissipation structure that projects beyond the module housing in a specific dimension, thereby increasing heat dissipation surface area while minimizing distance from heat source.

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

2Temperature

If liquid-based heat dissipation is used, then heat transfer efficiency is improved, but liquid may contaminate the module interior

Engineering Contradiction:

Improveheat transfer efficiencyVSAvoidliquid contamination

Core Design Contradiction:

TemperatureVSObject-affected harmful factors

Solution Approach 1:

The patent extracts and removes the liquid-based heat dissipation medium from the system, replacing it with a solid-state heat dissipation structure that extends from the electronic component, thereby eliminating the risk of liquid contamination while maintaining heat dissipation function.

Inventive Principle:

Principle #2Taking out (Extraction)

Solution Approach 2:

The patent converts the potential harm of liquid leakage by completely eliminating liquid from the heat dissipation system, using a solid heat dissipation body that provides the same thermal conduction function without the contamination risk associated with liquid media.

Inventive Principle:

Principle #22Blessing in disguise (Convert harm into benefit)

3Temperature

If heat dissipation component contacts substrate's copper pour, then heat dissipation function is provided, but signal interference may occur

Engineering Contradiction:

Improveheat dissipation functionVSAvoidsignal interference

Core Design Contradiction:

TemperatureVSObject-generated harmful factors

Solution Approach 1:

The patent introduces an insulating barrier or isolation structure as an intermediary between the heat dissipation body and the substrate's copper pour, allowing thermal conduction while preventing electrical signal interference, thus mediating between heat dissipation needs and signal integrity requirements.

Inventive Principle:

Principle #24Intermediary (Mediator)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This design enhances heat dissipation efficiency by effectively transferring heat away from the electronic components, maintaining a clean internal environment and optimizing signal transmission performance.

Implementation Method 1

The heat dissipation component includes a heat dissipation body and a thermally conductive medium. The heat dissipation body is located between the electronic component and the thermally conductive medium.

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 2

The heat dissipation body is in contact with the heat dissipation surface

Methodology Applied

Scientific EffectThermal radiation: Thermal Radiation

Implementation Method 3

The heat dissipation body extends through an opening

Methodology Applied

Scientific EffectConvection: Convection

Data Source

PatentUS20250329607A1Optical module including heat dissipation component in contact with electronic component

Publication Date: 2025.10.23 PRIME WORLD INT HLDG LTD

AI summary

The present disclosure provides an optical module, comprising a substrate, an electronic component, and a heat dissipation component. The electronic component is disposed on the substrate. The heat dissipation component is in thermal contact with the electronic component. The heat dissipation component includes a heat dissipation body and a thermally conductive medium. The heat dissipation body is located between the electronic component and the thermally conductive medium. The electronic component has a mounting surface and a heat dissipation surface opposite to each other. The mounting surface faces toward the substrate. The heat dissipation body is in contact with the heat dissipation surface.