Optical Module Housing With Concave Cavity For Height Reduction
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Solution Overview
Problem
The increasing transmission rate in optical communication technologies leads to a larger volume occupied by light-emitting and light-receiving sub-modules in optical modules, hindering further development.
Innovation Solution
An optical module design featuring a housing assembly with a light-receiving portion and a light-emitting cavity separated by a separation board, where the circuit board is inserted through a notch and the light-receiving and light-emitting assemblies are stacked, with a concave region in the light-emitting cavity to lift the laser assembly, reducing the height difference and optimizing space.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If the number of transmission channels is increased to improve transmission rate, then the transmission rate is improved, but the volume occupied by light-emitting and light-receiving sub-modules increases
Solution Approach 1:
The patent transitions from a planar arrangement to a three-dimensional stacked configuration, placing light-receiving sub-modules above light-emitting sub-modules separated by a separation board. This vertical stacking in the Z-dimension allows multiple transmission channels to coexist without increasing the footprint area, thereby improving transmission rate while controlling overall volume.
Solution Approach 2:
The housing assembly is divided into distinct segments: light-emitting cavity, separation board, and light-receiving portion. This segmentation allows independent optimization of each component and enables efficient spatial organization of multiple sub-modules, resolving the volume conflict while maintaining high transmission capacity.
2Productivity
If the volume of light-emitting and light-receiving sub-modules is increased to improve transmission rate, then the transmission rate is improved, but the overall height of the optical module increases
Solution Approach 1:
The laser assembly is nested within a concave region formed in the top plate of the light-emitting cavity. This nesting arrangement allows the laser assembly to be recessed into the cavity structure, utilizing the available internal space efficiently and reducing the protruding height, thereby controlling the overall module height while accommodating necessary components for high transmission rate.
Solution Approach 2:
The top plate of the light-emitting cavity is designed with a localized concave region rather than a uniform flat surface. This local modification creates a recessed area that houses the laser assembly, reducing the height at this critical location while maintaining the structural integrity and functional volume elsewhere in the housing assembly.
3Manufacturing precision
If the height difference between wire bonding surface and circuit board is reduced through laser assembly positioning, then the manufacturing precision is improved, but the device complexity increases
Solution Approach 1:
The concave region is pre-formed in the top plate of the light-emitting cavity during housing assembly manufacturing. This preliminary action establishes the correct height reference surface before the laser assembly is installed, ensuring that the wire bonding surface automatically achieves the desired height relationship with the circuit board, thereby improving manufacturing precision without requiring complex post-assembly adjustments.
Solution Approach 2:
The concave region structure enables the laser assembly to self-position at the correct height when installed. The recessed geometry provides mechanical guidance and constraint, allowing the assembly process to automatically achieve the required height precision without additional positioning mechanisms or complex adjustment procedures, thus improving precision while limiting complexity increase.
Data Source
AI summary
The present disclosure discloses an optical module including a circuit board; a housing assembly including a light-receiving portion and a light-emitting cavity separated via a separation board and stacked one above the other, one side of the housing assembly adjacent to the circuit board being provided with a first notch through which one end of the circuit board is inserted into the housing assembly; a light-receiving assembly disposed in the light-receiving portion and electrically connected to an upper surface of the circuit board; and a light-emitting assembly disposed in the light-emitting cavity and electrically connected to a lower surface of the circuit board; a concave region is formed in the light-emitting cavity, and a laser assembly of the light-emitting assembly is arranged therein to lift the laser assembly to reduce height difference between wire bonding surface of the laser assembly and lower surface of the circuit board.