Optical Module Thermal Management via Segmented Cover Plate
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Solution Overview
Problem
Digital light processing projectors using digital micromirror devices face overheating issues due to temperature differences between the light-emitting and non-emitting sides, which existing technologies have not adequately addressed.
Innovation Solution
An optical module design incorporating a substrate, optical element, cover plate, and heat-dissipating device, where the cover plate extends over the substrate and includes a heat-dissipating medium to efficiently transmit heat energy from both sides of the optical element, along with conductive and interconnection layers for enhanced thermal management.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Extent of automation
If a digital micromirror device is used to reflect light for image generation, then the projector can perform digital light processing, but temperature difference between the light-emitting side and rear side causes overheating problems
Solution Approach 1:
The heat dissipation system is segmented into multiple independent heat dissipation channels: one for the light-emitting side and another for the rear side. The cover plate includes a first heat dissipation portion extending toward the light-emitting side and a second heat dissipation portion extending toward the rear side, allowing separate heat management for each side of the optical element.
Solution Approach 2:
A heat dissipation medium is introduced as an intermediary between the optical element and the heat dissipation portions of the cover plate. This medium facilitates efficient thermal transfer from both sides of the optical element to the cover plate's heat dissipation structures, resolving the temperature difference issue while maintaining the digital light processing function.
2Temperature
If heat dissipation structures are added to address overheating, then thermal management improves, but device complexity and space requirements increase
Solution Approach 1:
The cover plate is designed to serve multiple functions simultaneously: it acts as a structural component of the housing, a mounting surface for the optical element, and a heat dissipation device. The integrated heat dissipation portions are formed as extensions of the cover plate itself, eliminating the need for separate heat dissipation components and reducing overall device complexity.
Solution Approach 2:
The heat dissipation system merges the cover plate structure with heat dissipation functions. The first and second heat dissipation portions are integrated into the cover plate design, combining structural support and thermal management into a single unified component rather than separate systems.
3Temperature
If traditional heat dissipation methods are used, then overheating is addressed, but the optical element cannot be easily replaced without damaging other components
Solution Approach 1:
The mounting structure is segmented to allow independent removal of the optical element. The optical element is mounted on the cover plate with mounting holes that align with holes in the housing, allowing the optical element to be removed through the opening without disassembling the entire housing or affecting other components.
Solution Approach 2:
The optical element is extracted as a separate, independently replaceable component. The mounting design allows the optical element to be taken out through the opening of the housing without removing or damaging the cover plate or other internal components, facilitating easy maintenance and replacement.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design effectively reduces overheating by allowing simultaneous heat dissipation from both sides of the optical element, minimizing space and cost requirements while enabling easy replacement of the optical element without damaging other components.
Implementation Method 1
a heat-dissipating medium disposed between the cover plate and the optical element, between the cover plate and the substrate, and/or between the substrate and the heat-dissipating device
Implementation Method 2
a conductive medium disposed between the substrate and the optical element... the conductive medium is electrically connected to the contact via the interconnection layer
Data Source
AI summary
An optical module is provided. The optical module includes a substrate, an optical element, a cover plate, and a heat-dissipating device. The optical element is disposed on the substrate, wherein the optical element has a first side and a second side opposite the first side. The cover plate is disposed on the second side of the optical element, and extends over the substrate. In addition, the substrate is disposed between the heat-dissipating device and the optical element.