Optical Module Housing Cover With Dual Cavities for Heat Dissipation

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Solution Overview

Problem

Optical modules face challenges in heat dissipation due to high power consumption, with existing methods like using a heat sink outside the module resulting in incomplete contact and low heat dissipation efficiency.

Innovation Solution

The optical module incorporates a housing cover with separate heat dissipation cavities and working media to transfer heat effectively, utilizing capillary layers and thermal insulation to enhance heat dissipation efficiency.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If a heat sink is provided outside the optical module, then heat dissipation is implemented, but the contact between surfaces is incomplete resulting in large thermal contact resistance and low heat dissipation efficiency

Engineering Contradiction:

Improveheat dissipation efficiencyVSAvoidthermal contact resistance

Core Design Contradiction:

TemperatureVSReliability

Solution Approach 1:

The patent merges the heat dissipation function with the housing cover structure by integrating cavities and working medium directly into the housing cover, eliminating the need for separate external heat sinks and improving thermal contact between the optical module and heat dissipation system

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The patent introduces a working medium (liquid or gas) as an intermediary between the optical module and the housing cover cavity to facilitate heat transfer, replacing direct solid-to-solid contact and reducing thermal contact resistance

Inventive Principle:

Principle #24Intermediary (Mediator)

2Productivity

If performance of optical module is increased, then functionality is improved, but power consumption increases leading to difficult heat dissipation

Engineering Contradiction:

Improveoptical module performanceVSAvoidpower consumption

Core Design Contradiction:

ProductivityVSUse of energy by moving object

Solution Approach 1:

The patent segments the heat dissipation system into multiple cavities (first cavity, second cavity) within the housing cover, each handling heat from different components, allowing for targeted and efficient heat management as power consumption increases

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The patent utilizes the three-dimensional space within the housing cover by creating cavities in different locations and orientations, enabling heat dissipation in multiple spatial dimensions and increasing overall heat dissipation capacity

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This design increases heat dissipation efficiency and reduces power density, protecting optical devices by preventing thermal interference and improving overall module performance.

Implementation Method 1

heat of the first device is transferred by means of heat transfer to a surface of the housing cover close to the first device. Because the first device and the first cavity are disposed opposite to each other, the heat enters the first cavity via the surface, the working medium in the first cavity transfers the heat to a cavity surface of the first cavity facing away from the first device, and then the heat is transferred to the outside of the optical module via the surface of the housing cover facing away from the first device

Methodology Applied

Scientific EffectHeat transfer: Conduction (thermal)

Implementation Method 2

heat of the second device is transferred by means of heat transfer to a surface of the housing cover close to the second device. Because the second device and the second cavity are disposed opposite to each other, the heat enters the second cavity via the surface, the working medium in the second cavity transfers the heat to a cavity surface of the second cavity facing away from the second device, and then the heat is transferred to the outside of the optical module via the surface of the housing cover facing away from the second device

Methodology Applied

Scientific EffectHeat transfer: Conduction (thermal)

Data Source

PatentUS20260016649A1Optical module and optical communication system

Publication Date: 2026.01.15 HUAWEI TECH CO LTD

AI summary

Embodiments of this application provide an optical module and an optical communication system, to resolve a technical problem of low heat dissipation efficiency of an optical module. The optical module includes a first device, a second device, and a housing cover. The housing cover includes a first cavity and a second cavity. A working medium in the first cavity is used to dissipate heat from the first device, and a working medium in the second cavity is used to take away heat of the second device.