Optical Module Heat Dissipation Sheet for Elastic Reassembly

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Solution Overview

Problem

Conventional heat dissipation materials in optical modules are difficult to disassemble and reassemble, leading to material damage, high labor costs, and insufficient cleaning, which affects performance due to lack of elastic contact.

Innovation Solution

An optical module with a heat dissipation elastic sheet that includes a heat dissipation portion and a deformation portion with hollow areas, allowing for easy assembly and disassembly, providing elastic contact to avoid excessive stress on components.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of operation

If conventional heat dissipation materials are used, then heat dissipation function is achieved, but disassembly and reassembly become difficult leading to material damage and high labor costs

Engineering Contradiction:

Improvedisassembly and reassembly easeVSAvoidmaterial integrity

Core Design Contradiction:

Ease of operationVSReliability

Solution Approach 1:

The heat dissipation elastic sheet is divided into a deformation portion and a heat dissipation portion, allowing the deformation portion to be flexible and easy to manipulate during assembly and disassembly, while the heat dissipation portion maintains its functional integrity

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The heat dissipation elastic sheet is designed as a flexible thin film structure that can be easily deformed and repositioned during assembly and disassembly operations, reducing the risk of material damage while maintaining effective heat dissipation contact

Inventive Principle:

Principle #30Flexible shells and thin films

2Reliability

If conventional heat dissipation materials are used, then heat dissipation function is achieved, but cleaning becomes insufficient affecting performance

Engineering Contradiction:

Improveoptical module performanceVSAvoidcleaning ease

Core Design Contradiction:

ReliabilityVSEase of manufacture

Solution Approach 1:

The flexible thin film structure of the heat dissipation elastic sheet allows it to conform precisely to the optical assembly surface, enabling thorough cleaning access and ensuring complete removal of contaminants that could affect optical performance

Inventive Principle:

Principle #30Flexible shells and thin films

3Reliability

If conventional heat dissipation elements are used, then heat dissipation function is achieved, but excessive force is applied to components affecting their performance

Engineering Contradiction:

Improvecomponent performanceVSAvoidcontact force on components

Core Design Contradiction:

ReliabilityVSForce

Solution Approach 1:

The flexible thin film structure distributes contact force evenly across the optical assembly surface, preventing concentrated excessive force on specific components while maintaining effective thermal contact

Inventive Principle:

Principle #30Flexible shells and thin films

Solution Approach 2:

The elastic sheet's material parameters are optimized to provide appropriate compliance, allowing it to deform and adapt to the optical assembly geometry without applying excessive force, thus protecting component performance

Inventive Principle:

Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The heat dissipation elastic sheet facilitates easy reusability, reduces labor costs, and maintains component performance by minimizing excessive force through its elastic properties.

Implementation Method 1

the deformation portion is provided with a hollow area so that the deformation portion can bend and deform

Methodology Applied

Scientific EffectElasticity: Elasticity

Implementation Method 2

providing elastic contact to avoid excessive stress on components

Methodology Applied

Scientific EffectStress Relaxation: Stress Relaxation

Implementation Method 3

heat generated by the optoelectronic chip is sequentially dissipated to the housing assembly through the heat sink and the heat dissipation elastic sheet

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentUS20250349655A1Optical module

Publication Date: 2025.11.13 INNOLIGHT TECHNOLOGY (SUZHOU) LTD

AI summary

The present application provides an optical module. The optical module comprises: a housing assembly; an optical assembly, disposed in the housing assembly; and a heat dissipation elastic sheet, sandwiched between the optical assembly and the housing assembly. The heat dissipation elastic sheet comprises a heat dissipation portion, and the heat dissipation portion is in contact with the optical assembly. The heat dissipation elastic sheet further comprises a deformation portion, the deformation portion is connected to the heat dissipation portion, and the deformation portion is bent relative to the heat dissipation portion. The deformation portion is provided with a hollow area, so that the deformation portion can be bent and deformed. In this way, the heat dissipation elastic sheet of the present application is convenient for secondary disassembly and assembly, and can be in elastic contact with an element to be cooled, thereby avoiding adverse effects as much as possible on performance of the element to be cooled due to excessive stress of the element to be cooled.