Optical Module Electronic Package with Embedded Wafer Level Ball Grid Array
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Solution Overview
Problem
Conventional optical modules face challenges with high assembly yield, robust reliability, and signal integrity due to differences in interconnect sizes and the use of fine pitch interconnects between various components, leading to issues like photo-detecting receiver IC overhang and die crack problems during mounting.
Innovation Solution
The integration of a photo-detecting receiver IC and receiver IC into a single mold using embedded wafer level ball grid array (eWLB) techniques, which reduces the number of die application processes, eliminates the need for copper pillars, and enables high-speed electrical connectivity through a redistribution layer, allowing for pre-assembly testability and a more compact design.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Power
If fine pitch flip chip interconnects are used for high density die stacking, then bandwidth density and RF performance are improved, but assembly yield and reliability deteriorate due to manufacturing difficulty
Solution Approach 1:
The invention segments the fine pitch interconnect function into two parts: coarse pitch interconnects for mechanical attachment between dies, and a redistribution layer (RDL) on the substrate to provide the fine pitch routing. This separates the mechanical bonding function from the electrical routing function, making assembly more reliable while maintaining high density interconnect capability through the RDL.
Solution Approach 2:
The substrate with redistribution layer acts as an intermediary between the coarsely pitched die interconnects and the fine pitch routing requirements. The RDL on the substrate redistributes the coarse pitch signals to fine pitch locations, enabling both reliable assembly and high density interconnect without directly attaching fine pitch interconnects to the dies.
2Adaptability or versatility
If multiple separate package configurations are used for different components, then functional requirements are met, but device complexity and assembly costs increase
Solution Approach 1:
The invention merges multiple separate package configurations into a single integrated substrate assembly. The substrate with redistribution layer consolidates the interconnection function for multiple dies (transmitter, receiver, power management) that would otherwise require separate packages, reducing overall device complexity while maintaining all required functions.
Solution Approach 2:
The substrate with redistribution layer serves multiple functions simultaneously: it provides mechanical support for multiple dies, enables coarse pitch interconnect attachment, provides fine pitch routing through RDL, and facilitates signal distribution to multiple components. This multi-functional substrate replaces what would otherwise require multiple specialized packages.
3Ease of manufacture
If large bump interconnect pitch is used for attaching silicon photonics transmitter and power management IC, then ease of manufacture is improved, but signal integrity deteriorates compared to fine pitch interconnects
Solution Approach 1:
The interconnect function is segmented into two stages: first, coarse pitch interconnects provide easy mechanical attachment and alignment; second, the redistribution layer on the substrate provides the fine pitch routing needed for signal integrity. This segmentation allows each stage to optimize for its specific purpose without compromise.
Solution Approach 2:
The solution moves the fine pitch interconnect function from the vertical dimension (direct die-to-die attachment) to the horizontal dimension (routing on the substrate surface). The redistribution layer traces on the substrate provide fine pitch electrical paths without requiring fine pitch mechanical attachment, effectively using the substrate plane as another dimension for achieving fine pitch connectivity.
Data Source
AI summary
Some forms include an electronic package that includes a photo-detecting receiver IC and a receiver IC. The electronic package includes a mold that encloses the photo-detecting receiver IC and the receiver IC. The photo-detecting receiver IC and the receiver IC are adjacent to one another without touching one another. Other forms include an optical module that includes a substrate and an electronic package mounted on the substrate. The electronic package includes a photo-detecting receiver IC and a receiver IC that are enclosed within a mold. The photo-detecting receiver IC and the receiver IC are adjacent to one another without touching. Other forms include a method that includes forming a mold that includes a photo-detecting receiver IC and a receiver IC that are adjacent to one another without touching. The photo-detecting receiver IC includes optical components that are exposed on a surface of the mold.