Optical Module Fiber Management for Heat and Coupling Stability
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Solution Overview
Problem
Existing optical modules face challenges in efficiently managing heat dissipation and fiber management within a compact design, particularly with increasing power density and the need for precise optical coupling between silicon optical chips and laser assemblies, which can be disrupted by material expansion and misalignment.
Innovation Solution
The optical module incorporates a protective cover with sub-covers and limiting structures to manage internal optical fibers and bonding wires, while using a common base for silicon optical chips and laser assemblies to maintain alignment, and employs a rigid circuit board for heat dissipation and electromagnetic shielding.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If a compact design is used for the optical module, then the size is reduced, but heat dissipation becomes difficult
Solution Approach 1:
The optical module is divided into distinct functional regions: a first region housing the laser assembly and a second region housing the silicon optical chip. This segmentation allows optimized heat management for each component type while maintaining overall compactness. The circuit board is also segmented into different areas for different functional components.
Solution Approach 2:
A heat dissipation component is introduced as an intermediary between the laser assembly and the circuit board. This heat dissipation component includes a first heat dissipation portion positioned near the laser assembly and a second heat dissipation portion positioned near the silicon optical chip, facilitating efficient heat transfer from high-power components to the circuit board for overall thermal management.
2Device complexity
If material expansion is not accounted for, then the design is simpler, but optical coupling precision deteriorates
Solution Approach 1:
The patent introduces compensation structures that account for thermal expansion parameters. The housing and mounting structures are designed with expansion compensation features that allow for material expansion while maintaining the relative positional relationships between optical components, thereby preserving optical coupling precision despite temperature variations.
Solution Approach 2:
The design incorporates pre-designed compensation structures and flexible mounting mechanisms that anticipate thermal expansion effects. These structures are built into the housing and mounting systems beforehand to cushion and accommodate material expansion, preventing misalignment and maintaining optical coupling precision under thermal stress.
3Ease of operation
If separate mounting structures are used for silicon optical chips and laser assemblies, then alignment is easier, but misalignment occurs due to material expansion
Solution Approach 1:
The patent merges the mounting functions for the laser assembly and silicon optical chip into a unified mounting system on the circuit board. The circuit board serves as a common mounting platform with integrated mounting structures that secure both components, ensuring their relative positions remain stable even when materials expand, thereby maintaining precise optical coupling.
Solution Approach 2:
The circuit board is designed with multi-functional mounting structures that simultaneously serve as mounting platforms for both the laser assembly and the silicon optical chip. These universal mounting structures incorporate thermal expansion compensation features that maintain alignment stability for both components under varying thermal conditions.
4Device complexity
If fiber management is not optimized, then the structure is simpler, but optical coupling precision deteriorates
Solution Approach 1:
The patent implements preliminary positioning structures for optical fibers during the assembly process. Fiber positioning features and alignment guides are pre-configured in the housing and mounting structures to ensure precise fiber alignment with optical components before final assembly, maintaining optical coupling precision without requiring complex post-assembly adjustments.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enhances heat dissipation and fiber management, maintaining optical coupling precision and reducing misalignment issues, thereby improving the performance and reliability of high-speed optical modules.
Implementation Method 1
a rigid circuit board for heat dissipation
Implementation Method 2
maintain alignment, and employs a rigid circuit board for heat dissipation and electromagnetic shielding
Implementation Method 3
employs a rigid circuit board for heat dissipation and electromagnetic shielding
Data Source
AI summary
An optical module includes a circuit board, an internal optical fiber, a first light transceiver component, a second light transceiver component, and a protective cover. The internal optical fiber includes a first optical fiber strip and a second optical fiber strip. The protective cover includes a first protective sub-cover and a second protective sub-cover. The first protective sub-cover covers the first light transceiver component and includes a first body, two rods, and two limiting structures. The two limiting structures are disposed on the two rods and configured to limit the first optical fiber strip and the second optical fiber strip. The second protective sub-cover covers the second light transceiver component and is connected to the first protective sub-cover. The second protective sub-cover is located between the two rods.