Optical Module Alignment Fixing via High Softening Point Resin
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Solution Overview
Problem
Conventional optical modules experience signal loss due to misalignment between the optical element and the optical waveguide, which occurs during the reflow soldering process when mounting electronic circuit chips, as the underfill resin softens at low temperatures and cannot prevent positional errors.
Innovation Solution
A fixing member made of a potting resin with a softening point higher than the melting point of the conductive bonding material is used to securely attach the optical element to the optical waveguide before mounting the electronic circuit chip, preventing misalignment and tilt.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If underfill resin is used to fix the optical element to the optical waveguide, then the optical element can be positioned, but the alignment is lost during reflow soldering because the underfill resin softens at low temperatures
Solution Approach 1:
The patent applies preliminary action by using the underfill resin to preliminarily position and fix the optical element to the optical waveguide before the reflow soldering process. This preliminary fixation maintains alignment precision during subsequent manufacturing steps, preventing the alignment loss that would otherwise occur when the underfill resin softens during reflow soldering.
2Ease of manufacture
If conventional bonding methods are used to attach the optical element, then the optical element can be fixed, but misalignment and tilt occur during reflow soldering causing optical signal loss
Solution Approach 1:
The patent applies parameter changes by modifying the thermal properties of the bonding system. The underfill resin is selected with specific softening characteristics that allow it to remain stable during reflow soldering temperatures, preventing misalignment and tilt. This parameter optimization ensures both ease of manufacture and maintenance of alignment precision throughout the manufacturing process.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach effectively reduces optical signal loss by maintaining the alignment of the optical element with the waveguide, even during the reflow soldering process, and is applicable to both light emitting and receiving elements.
Implementation Method 1
a fixing member configured to fix the optical element to the optical waveguide
Implementation Method 2
an optical path conversion mirror provided on the core layer or the second cladding layer, wherein the optical element is optically coupled to one end of the core layer via the optical path conversion mirror
Data Source
AI summary
An optical module includes a wiring board having a first electrode, an optical waveguide provided on the wiring board, an optical element having a second electrode and provided on the optical waveguide, a conductive bonding material bonding the first and second electrodes, and a fixing member that fixes the optical element to the optical waveguide. The optical waveguide includes a core layer, a first cladding layer provided on a first side of the core layer, a second cladding layer provided on a second side of the core layer opposite to the first side, and an optical path conversion mirror provided on the core layer or the second cladding layer. The optical element is optically coupled to one end of the core layer via the optical path conversion mirror, and a softening point of the fixing member is higher than a melting point of the conductive bonding material.