Optical Module Flexible PCB Parasitic Reduction
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional optical modules suffer from limited modulation bandwidth due to parasitic inductance and capacitance in wire-bonded connections between optoelectronic transducers and auxiliary dies, degrading signal integrity.
Innovation Solution
A high-speed optical module apparatus featuring a silicon optical bench with a flexible printed circuit board (PCB) that mounts optoelectronic transducers and an auxiliary die in close proximity, using conductive traces to minimize parasitic effects and a light rotation module with mirrors or lenses to direct optical signals perpendicularly, thereby reducing electrical parasitics and enhancing modulation bandwidth.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If wire-bonded connections are used between optoelectronic transducers and auxiliary dies, then electrical signals can be transmitted between components, but parasitic inductance and capacitance increase, degrading signal integrity and limiting modulation bandwidth
Solution Approach 1:
The patent extracts and eliminates the wire-bonded connection structure from the system. By removing the wire bonds that cause parasitic inductance and capacitance, the invention directly addresses the harmful factors while maintaining electrical signal transmission through alternative means (direct mounting of auxiliary dies to the substrate).
Solution Approach 2:
The patent introduces a substrate as an intermediary structure that directly mounts both the optoelectronic transducers and auxiliary dies. This substrate serves as a mediator that provides electrical connections without requiring wire bonds, thereby eliminating the parasitic effects while maintaining signal transmission functionality.
2Productivity
If optoelectronic transducers and auxiliary dies are mounted separately with wire bonds, then assembly is conventional and straightforward, but modulation bandwidth is limited due to parasitic effects
Solution Approach 1:
The patent merges the mounting of optoelectronic transducers and auxiliary dies onto a common substrate structure. By combining these components and their electrical connections into a single integrated assembly, the invention eliminates wire bonds and reduces parasitic effects, thereby increasing modulation bandwidth while simplifying the overall assembly structure.
3Manufacturing precision
If conventional hybrid assembly techniques are used with high precision alignment processes, then optical fiber core to optoelectronic transducer alignment can be achieved, but manufacturing complexity and time increase
Solution Approach 1:
The patent applies preliminary action by pre-positioning and pre-aligning components on the substrate before final assembly. The substrate is designed with predetermined mounting locations and alignment features that guide the placement of optoelectronic transducers and auxiliary dies, eliminating the need for time-consuming post-assembly alignment adjustments.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Significantly improves modulation bandwidth by reducing parasitic capacitance and inductance, enabling higher data transmission rates up to 50 GHz while maintaining signal integrity.
Implementation Method 1
The light rotation module has a bottom surface mounted on the base substrate and a top surface coupled to one or more optoelectronic transducers, and is configured to direct optical signals between the respective optoelectronic transducers and optical ports
Implementation Method 2
In other embodiments, the one or more mirrors are slanted. Yet in other embodiments, the one or more mirrors are curved. In some embodiments, the one or more mirrors include respective optical gratings. In other embodiments, the apparatus can also include respective lenses coupled to the one or more mirrors.
Data Source
AI summary
An apparatus includes a base substrate, a light rotation module and a flexible printed circuit board (PCB). The light rotation module has a bottom surface mounted on the base substrate and a top surface coupled to one or more optoelectronic transducers, and is configured to direct optical signals between the respective optoelectronic transducers and optical ports on a side perpendicular to the top surface. The flexible printed circuit board (PCB) includes a first end that is attached to the top surface of the light rotation module and has the optoelectronic transducers mounted thereon, a second end attached to the base substrate, and conductive traces disposed between the first and second ends to direct electrical signals between the optoelectronic transducers and the base substrate.