Optical Module Flip-Chip Interconnect for Higher Chip Bandwidth
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Solution Overview
Problem
Conventional gold wire bonding in optical modules limits the increase in bandwidth between digital signal processing chips and optoelectronic chips, failing to meet growing bandwidth requirements.
Innovation Solution
The optical module employs a flip-chip connection method where the signal line of the substrate is connected to the circuit board, allowing the digital signal processing chip and optoelectronic chip to be electrically connected on the same side, utilizing a ceramic substrate with a heat-insulating substrate for thermal management and bandwidth enhancement.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If gold wire bonding is used to connect the circuit board and substrate, then the connection is reliable and easy to manufacture, but the bandwidth between the digital signal processing chip and optoelectronic chip is limited
Solution Approach 1:
The patent extracts the signal transmission function from the gold wire bonding process and relocates it to the circuit board trace layer. By removing the intermediate gold wire connection and using direct PCB trace routing between the digital signal processing chip and optoelectronic chip, the bandwidth is significantly improved while maintaining connection reliability through the rigid PCB structure.
Solution Approach 2:
The patent transitions from a three-dimensional gold wire bonding approach to a two-dimensional PCB trace connection approach. The signal transmission is embedded within the circuit board plane rather than extending externally through wires, reducing signal path length and increasing bandwidth while improving manufacturing integration.
2Ease of manufacture
If the digital signal processing chip and optoelectronic chip are connected through gold wire bonding, then the manufacturing process is simple, but the bandwidth requirement cannot be met
Solution Approach 1:
The patent merges the signal transmission function into the circuit board structure itself. The circuit board serves dual purposes: as the mechanical support structure and as the signal transmission medium through its internal traces. This integration eliminates the need for separate gold wire bonding processes while providing high-bandwidth communication between chips.
3Device complexity
If conventional gold wire bonding is used, then the device structure is simple, but thermal management becomes difficult with increasing bandwidth requirements
Solution Approach 1:
The patent makes the circuit board multi-functional by integrating both signal transmission and thermal management functions. The PCB traces that carry signals also serve as thermal conduction paths, and the circuit board's layered structure provides both electrical connectivity and thermal dissipation channels, eliminating the need for separate thermal management components.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration significantly increases bandwidth between the digital signal processing chip and the optoelectronic chip compared to conventional gold wire bonding, while also ensuring effective thermal management and stability.
Implementation Method 1
the substrate includes: a heat-insulating substrate, the second electrical connection point being located on a surface of the heat-insulating substrate; and a ceramic substrate, the optoelectronic chip being installed on the surface of the ceramic substrate, and the ceramic substrate and the circuit board being thermally isolated by the heat-insulating substrate
Implementation Method 2
the fourth surface and the housing are thermally connected through a second thermal conductor
Data Source
AI summary
An optical module (100, 200, 300), comprising a housing (11, 21, 31) as well as a circuit board (12, 22, 32), a digital signal processing chip (13, 23, 33), a substrate (14, 24, 34) and an optoelectronic chip (15, 25, 35) which are located within the housing (11, 21, 31). The circuit board (12, 22, 32) is provided with, in the thickness direction, a first surface (121, 221, 321) and a second surface (122, 222, 322) which are disposed opposite to one another. The digital signal processing chip (13, 23, 33) is electrically connected to a signal line (1201, 2201) of the circuit board (12, 22, 32) at the first surface (121, 221, 321). The substrate (14, 24, 34) is provided with a third surface (142, 242) and a fourth surface (141, 241) which are disposed opposite to one another. The optoelectronic chip (15, 25, 35) is electrically connected to a signal line (1401, 2401) of the substrate (14, 24, 34). The signal line (1201, 2201) of the circuit board (12, 22, 32) is provided with a first electrical connection point formed on the first surface (121, 221, 321), and the signal line (1401, 2401) of the substrate (14, 24, 34) is provided with a second electrical connection point formed on the third surface (142, 242), the first electrical connection point being electrically connected to the second electrical connection point. In this way, the signal line (1401, 2401) of the substrate (14, 24, 34) is inversely connected to the signal line (1201, 2201) of the circuit board (12, 22, 32) by means of the second electrical connection point. Compared with conventional connection means of gold wire bonding, the bandwidth between the digital signal processing chip (13, 23, 33) and the optoelectronic chip (15, 25, 35) may be greatly improved.