Subminiature Optical Transmission Module With FOWLP Auto-Alignment
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Solution Overview
Problem
The assembly of optical transmission modules, particularly the alignment between edge-type light emitting elements and arrayed waveguide gratings, faces significant challenges due to height tolerance and misalignment issues, leading to increased assembly costs and complexity, especially in miniaturizing these components for high-speed optical communication systems.
Innovation Solution
The implementation of a Fan Out Wafer Level Packaging (FOWLP) scheme automates optical alignment in all x, y, and z directions between edge-type light emitting elements and optical components, using a mold body with a wiring layer as top cladding to match the optical axis heights and integrate electrical elements, thereby simplifying the assembly process and reducing module size.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conventional assembly methods are used for aligning edge-type light emitting elements and arrayed waveguide gratings, then optical alignment precision can be achieved, but assembly complexity and cost increase significantly
Solution Approach 1:
The patent applies preliminary action by pre-forming the optical component array on a substrate with predetermined positions and heights before assembly. The arrayed waveguide gratings are fabricated with precise spacing and alignment features integrated into the substrate structure, eliminating the need for complex post-assembly alignment adjustments. This preliminary preparation of the optical component array resolves the contradiction by achieving high precision through upfront manufacturing rather than complex assembly procedures.
2Volume of moving object
If optical transmission modules are miniaturized for high-speed communication systems, then data transmission capacity increases, but alignment tolerance decreases making assembly more difficult
Solution Approach 1:
The patent merges the optical component array with the substrate by fabricating the arrayed waveguide gratings directly on the substrate with integrated positioning structures. The substrate serves dual functions as both the mounting platform and the alignment reference, eliminating separate alignment components. This merging allows miniaturization while maintaining alignment tolerance because the reduced distances between components are compensated by the integrated substrate-based positioning system.
3Reliability
If edge-type light emitting elements and optical components are aligned with height tolerance compensation, then optical coupling efficiency improves, but assembly process complexity increases
Solution Approach 1:
The patent applies local quality by creating localized height adjustments at specific coupling points between the light emitting elements and the arrayed waveguide gratings. The substrate includes locally-formed support structures or recesses at precise positions to compensate for height tolerances only where optical coupling occurs, rather than requiring uniform height compensation throughout the entire assembly. This localized approach maintains optical coupling efficiency while simplifying the overall assembly process.
Data Source
AI summary
Provided are a subminiature optical transmission module and a method for manufacturing same. The optical transmission module includes: a mold body having a first surface and a second surface opposite to each other; multiple edge-type light emitting elements, each of which is molded inside the mold body by fitting same to the first surface so as to match with the first surface and generates an optical signal in the edge direction of a chip; and an optical component disposed on one side thereof so as to optically multiplex multiple optical signals incident from the multiple edge-type light emitting elements and to output same, wherein the identical height is configured between the surface of each light emitting element and the optical axis of the optical component, and the edge direction of the chip is parallel to the first surface of the mold body.